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Topics Covered
Introduction
Master Bond UV22: One
Component, UV Curable, Highly Nanosilica Reinforced Epoxy System
Advantages of Master Bond UV22
Electrical
Insulation Properties of Master Bond UV22
Typical
Applications for Master Bond UV22 UV Curable Highly Nanosilica Reinforced Epoxy
System
Optical/LCD/LCP
Medical
Electronic
Bonding/Lamination (Non-Optical)
Important UV
System Performance Requirements
With An Emphasis on
Innovations
Custom Formulations
Introduction
In the highly competitive climate of today's nanoengineering industry,
manufacturers are constantly on the search for new, innovative methods of
production and design. Master Bond nano grade UV cure systems serve as a cost
effective solution to the advanced adhesive needs of the nano industry. The
superiority of these systems lay in their ability to cure in seconds, speeding
production and processing times, while maintaining the high performance
characteristics of standard epoxy systems.
Get the competitive advantage you need. Master Bond
nano grade UV curable bonding, sealing, coating and potting & encapsulation
compounds are single component and require no weighing or mixing prior to use.
They are designed to eliminate waste, save energy, increase efficiency and
improve reliability. Environmentally safe, they emit no volatiles or vapors
during cure. In addition, because of their storage stability, pot life issues
are essentially eliminated. All this and more make Master Bond
UV systems the adhesive of choice for nano engineers in search of high
performance solutions.
Master Bond UV22: One Component, UV Curable, Highly Nanosilica Reinforced
Epoxy System
Master
Bond Polymer System UV22 represents a remarkable technological breakthrough
in the utilization of nanotechnology in the formulation of a one component UV
curable epoxy for coating, sealing, and encapsulation applications. This
nanosilica filled system features superior physical properties, enhanced
abrasion resistance, excellent optical clarity along with significantly reduced
shrinkage after curing.
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The performance properties of UV22
surpass those of similar non-reinforced systems by as much as 50-90%. The
cycloaliphatic epoxy resin phase offers superior chemical and physical
properties together with improved light stability. The silica phase is comprised
of surface modified synthetic silicon dioxide nanospheres of very small size
(<50nm) and with a very narrow particle size distribution. Despite the
remarkably high percentage of nano particles present in the UV22, it
still retains high transparency and a desirably low viscosity without
sedimentation. This is due to the stability of the agglomerate-free colloidal
dispersion of the reinforcing nanosilica particles in the resin phase.
UV22
cures rapidly using light sources emitting a wavelength with 250-365nm with an
energy output of as little as 20-40 milliwatts/cm2 with higher output
facilitating a faster cure. It can cure within 5-10 seconds with proper UV
curing lamps. The shrinkage upon cure is less than 2%. UV22 can be
used over the wide temperature range of -60 to 300°F and will cure in
thicknesses up to 1/8th of an inch. Additionally, UV22 has
excellent electrical insulation properties, and the viscosity of the UV22 system
is adjustable to meet specific requirements.
Unlike many other UV curable products, UV22 is not
oxygen inhibited and exhibits a fast cure at ambient temperatures, even in the
presence of air. Post-curing the UV22
enhances its temperature resistance profile. Adding heat (200-230°F for 30
minutes) will increase the glass transition temperature to >120°C, higher
than traditional UV systems. The post cure is also effective in increasing its
chemical resistance to solvents, acids and bases. A specially formulated version
called UV22DC is available for dual-curing via UV light at ambient temperatures
and/or by application of heat e.g. 80-110°C for approx. 1/2 hour to 1 hour. Dual
cure UV's are desirable to cure this product in "shadowed out" areas (a section
where UV light is unable to reach the material to be cured).
Advantages of Master Bond UV22
Advantages of Master Bond UV22 highly nanosilica reinforced epoxy system
include:
- Greatly enhanced physical properties including the tensile modulus and
tensile strength.
- Ideal for coating and encapsulation.
- No filler sedimentation upon storage.
- Excellent optical clarity with high filler loading.
- Exceptionally low shrinkage; Low coefficient of thermal expansion.
- Increased hardness and abrasion resistance.
- Improved shock and vibration resistance.
- Significantly enhanced fracture toughness.
- Superior electrical insulation properties for outdoor as well as indoor
exposures.
- Enhanced chemical and permeability resistance to aggressive liquids and
gases.
- Reduced exotherm during curing.
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Table 1: Typical Properties of Master Bond UV22
Coatings
| Property |
Value |
| Viscosity, uncured coating, 75°F |
3500-6500 |
| Solvents and other volatiles |
0 % |
| Density at 75°F |
1.4 gms/ml |
| Acetone double rubs |
>200 |
| Shore hardness D |
>80 |
| Elongation |
3-4 % |
| Tensile Strength |
>4,600 psi |
| Tensile Modulus |
>500,000 psi |
| Flexural Strength |
4,500 psi |
| Coefficient of linear expansion |
35-40 ppm per °C |
| Glass transition temperature |
>90°C |
| Glass transition temperature with
post cure |
>120°C |
| Water resistance (5 minute post cure
at 300°F) 3 months immersion |
<1 % weight gain |
| Refractive index |
1.52 |
| Abrasion resistance (steel wool test,
50 cycles) weight change of specimen |
10-12mg |
| Water vapor permeability [gl(m2·d)]
45 um cardboard film |
170 |
| Shrinkage |
<2 % |
| Service temperature range |
-60 to 300 °F |
| Shelf life, unopened containers at
75°F |
6 months |
| Available in syringes, pints, quarts,
gallons and 5 gallon pails. |
|
Electrical Insulation Properties of Master Bond UV22
The electrical insulation properties of Master Bond UV22 are
shown in Table 2. This data was obtained on 0.125" thick plaques which had been
cured at a rate of 14 feet/min with a 200 watt/inch medium pressure mercury
vapor lamp UV source and then aged for one week at room temperature before
evaluation. They show that the Master Bond UV22 system
exhibits greatly superior electrical insulation resistance characteristics up to
300°F.
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| Property |
Value |
| Volume Resistivity |
<1.5 x 1012 |
| Dielectric Constant, 106, 25°C |
3.16 |
| Dielectric Constant, 106, 100°C |
3.80 |
| Dielectric Constant, 106, 150°C |
3.94 |
| Dissipation Factor, 106, 25°C |
0.005 |
| Dissipation Factor, 106, 100°C |
0.034 |
| Dissipation Factor, 106, 150°C |
0.041 |
Typical Applications for Master Bond UV22 UV Curable Highly Nanosilica
Reinforced Epoxy System
Optical/LCD/LCP
Typical applications of Master Bond UV22 UV Curable Highly Nanosilica Reinforced Epoxy
System for optical/LCD/LCP applications include:
- Bonding glass and plastic fibers to fiber optic connectors and ferrules
- Optical Replication
- Coating, potting, or bonding optically clear and/or optically sensitive
components and indicators
- Mounting fiber optics
- Fiber optic splicing
- Fiber optic and lens bundling and terminating
- Lens and prism bonding
|
- Encapsulation of detectors
- Fillet bond where good optical transmission in UV, visible, or infrared
range is required
- Mounting, fixturing, laminating, tacking, bonding, and sealing of borescopes
(remote video scopes) and doublets (stacked lenses)
- YAG Lasers (Yttrium aluminum garnet-synthetic crystalline material. Used in
manufacturing, and to mark/cut metals)
- LCD Laminations
- Polarizer Laminations
- LCD Sealant
|
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Medical
Typical applications of Master Bond UV22 UV Curable Highly Nanosilica Reinforced Epoxy
System for medical applications include:
- Needle assembly and bonding (heat exchanger assembly, metal bonding,
transducer assembly, potting, bonding connectors)
- Respiratory devices
- Breathing mask assembly
- Tracheotomy tube assembly
- Resuscitator apparatus
- Bags for storing liquid contents (drips, IV, saline, waste, etc.)
- Can be used to fabricate "Form in place" gaskets
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- Catheter bonding, sealing, and assembly
- Guide wire assembly
- Bore tube sealing
- Balloon bonding
- Sensor attachment
- Tube joining
- Catheter hubs
- Bonding of plastics including PVC & SEBS
(styrene-ethylene/butylene-styrene)
|
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Electronic
Typical applications of Master Bond UV22 UV Curable Highly Nanosilica Reinforced Epoxy
System for electronic applications include:
- Encapsulation and coating for environmental protection [shadowed out areas
can be cured with heat (double cure)]
- Glob top
- Strain relief or chip encapsulation
- Precision application to specific electronic assembly areas
- Thin coating, wicking, and underfill
- Plastic bonding, potting, and sealing
- Wire tacking and coating
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- Capacitor bonding
- Chip bonding
- Tamper-proofing components
- Prevent coils from unwinding
- Sealing and potting electrical components
- HGA (head gimbal assembly) and tamper-proofing
|
Bonding/Lamination (Non-Optical)
Typical applications of Master Bond UV22 UV Curable Highly Nanosilica Reinforced Epoxy
System for bonding/lamination (non-optical) applications include:
- Polishing
- Protective coating for abrasion resistance, and water or chemical resistance
- Crystal assembly
- Glass laminations/sealing/potting/bonding
- Bonding metal, steel, and aluminum to glass
- High peel/cleavage strength for glass and metal bonding
- Bonding transparent plastics such as acrylics and polycarbonate to various
metals
- Flexible plastic assemblies
- Flexible and rigid bonding of clear plastics
- Rapid bonding and sealing of plastics to stainless steel, polycarbonate, and
PVC
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- Mirror assembly
- Bonding glass to thermoset plastics, polycarbonates, acrylics, phenolic, and
filled plastics
- Spin coating UV curables for glass and other substances
- Glass cationic epoxy and encapsulant
- Gap filling of non-flat, irregular and handmade glass
- Bond plastic to ABS, CAP, MBS, PBT, PET, PP, PS, PVC, SAN, Valox, acrylic,
brass, ceramic, glass PETG, nylon polyimide, polarized and polyester film,
polycarbonate, polystyrene, polyurethane, styrene mylar
- Wire harness assembly
- Plastic potting, laminating, and sealing
- Sealing PVC, PET, A-PET, R-PET clamshell packages
- Bonding rigid fittings to flexible tubing
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Important UV System Performance Requirements
Master
Bond UV curable systems are designed to meet specific performance
requirements. Among the most important are:
- Abrasion resistance
- Chemical resistance
- Easily polished
- Easily repairable
- Electrically insulative
- Excellent adhesion
- Dimensional stability
- Impact resistance
- Reworkable
- Screen printable
- Spectral transmittance
- Spin coatable
- Peel strength
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- Optical transmission
- High temperature resistance
- Index of refraction
- Low coefficient of expansion
- Low outgassing
- Low shrinkage
- Low stress
- Shock resistance
- Non-yellowing
- Resistance to water
- Durability
- Thermal cycling
- Vibration resistance
|
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With An Emphasis on Innovations
Recently Introduced UV curable UV10TKLO-2 meets low-outgassing requirements per
NASA ASTM E-595, presenting engineers with the rare combination of a UV cure adhesive and low
outgassing properties. The UV10TKLO-2 modified epoxy
system offers optical clarity, high physical strength properties and good
chemical resistance. It is not oxygen-inhibited and cures rapidly at room
temperature when exposed to UV light. Maximum UV absorption takes place in the
320- to 365-nm range. It is easy to apply, has high viscosity and can be used in
a variety of optical, electro-optical and vacuum applications. Exhibiting good
electrical insulation properties, it has a volume resistivity of >1014 Ù cm
and a dielectric constant of 3.6 at 60 Hz. Service temperature range is -51 to
149 °C.
Custom Formulations
The many potential applications of nano grade UV cure adhesives make
for a very complex selection process; one requiring much research of all
relevant considerations. It is for this reason that Master Bond
Inc. offers custom formulated solutions, tailor made products possessing the
specific properties necessary for successful employment. Regardless of the
application requirements, adhesive formulations may be adjusted to possess all
required characteristics. The unique line of Master
Bond, nano grade UV cure systems may be formulated to withstand the stresses of
any hi-tech application, including extreme temperatures, thermal cycling and
shock, mechanical forces, vibration, and chemical exposure. Specific adhesive
systems can be designed to meet USP Class VI certification for medical use and
biocompatibility, and NASA requirements for low outgassing. In addition,
specific properties such as viscosity, flexibility, and bond strength are
incorporated based on specific application, maximizing system compatibility and
performance.
Master
Bond Inc. has available a fast growing family of one component UV curable
systems. They include polyurethanes, epoxies, polyesters and acrylics. They
vary in thicknesses, hardness, chemical resistance, strength, clarity, etc. When
exposed to a suitable UV light source, UV curable compounds will cure in a
matter of seconds. The Master Bond products are not oxygen inhibited and cure at
ambient temperatures. Environmentally friendly, they are 100% reactive liquids
which do not contain any solvents or other volatiles. Upon cure they exhibit
minimal shrinkage. Additionally, their electrically insulative properties make
them especially suitable for microelectronic
applications. High Temperature resistant grades are available. With Master
Bond's unparalleled experience and expertise, they guarantee the development
and successful implementation of a customized solution for your nanoelectronic
application.
Source: Master Bond
For more information on this source please visit Master
Bond.