Tegal Corporation, (Nasdaq:TGAL)
an innovator of specialized production solutions for the fabrication of advanced
MEMS, power ICs and optoelectronic devices, today announced that its full process
portfolio for silicon DRIE applications has been made available for the new
ProNova ICP source. The application suite includes industry-leading processes
for high aspect ratio DRIE under the SHARP patent, as well as well-established
processes for integrated mask open and the tri-pulse process for high resist
mask selectivity deep silicon etching.
A key challenge for 200mm MEMS fabrication is porting established MEMS processes
onto 200mm tools and then improving on the baseline process results; for silicon
DRIE, these challenges include achieving higher etch rates, tighter control
of tilt angles and etch profiles across 200mm wafers, and tighter control of
etch depth uniformity across 200mm wafers The ProNova ICP process suite now
helps solve these challenges.
“Providing our customers with high-value DRIE process solutions is at
the core of our business model,” said John Almerico, Senior Marketing
Director for Etch Products at Tegal. “Transferring our advanced applications
for silicon DRIE to 200mm wafers using the ProNova ICP source successfully completes
the launch of this new process module for MEMS and 3D-IC customers worldwide.”
The ProNova ICP source is available immediately to ship on Tegal 110, 200,
3200, and 4200 DRIE Wafer Processing Systems. ProNova is also compatible as
a retrofit with Tegal and AMMS DRIE systems already in the field, and ProNova
supports SHARP – Tegal’s Super High Aspect Ratio Process, achieving
etched feature aspect ratios of greater than 100:1 in production environments.
In addition, all Tegal silicon DRIE systems now feature low frequency bias for
notch-free silicon DRIE for SOI substrates as standard equipment. Customers
interested in submitting samples to evaluate the ProNova ICP source should contact
their local Tegal sales office or sales representative.
Tegal is a participating sponsor of the MEMS Executive Congress this week in
Sonoma, California. Paul Werbaneth, Tegal Vice President of Marketing and Applications,
will be moderating a panel discussion titled “Energy/Environmental Sensing
and Green MEMS.” More information about the MEMS Executive Congress is
available at www.memscongress.com.