By Cameron Chai
EV Group recently declared that CEA-Leti has incorporated multiple EVG tools in its 300mm clean-room for research and development and developing three-dimensional integration applications.
The facility will use EVG equipment to develop technology for mass production of three-dimensional applications and small scale manufacture of 300mm wafers processes suitable for mass production environments.
CEA-Leti will utilize an IQ Aligner production mask system, a SmartView NT precision bond alignment system, an EVG560 production wafer bonding system and an EVG850 production bonding system for direct wafer bonding applications. CEA-Leti will exploit EVG's process know-how in 3D integration and in through-silicon via (TSV) production.
EVG collaborates with research groups and institutions including CEA-Leti and global consortia like EMC-3D, an organization focusing on reducing three-dimensional chip costs, SEMI, NILCOM, a Consortium for Commercialization of Nanoimprint Lithography, NIL Austria, and Mancef (Micro and Nanotechnology Commercialization Education Foundation). According to market analyst Frost & Sullivan, these endeavors help reduce research and development in technology development costs. The market analyst recently honored EVG with its 2010 Europe Product Innovation Award in Nanoimprint Technology.