Sematech declared that Fujifilm is now part of the Resist Materials and Development Center (RMDC) and would be working with them on critical resist issues in extreme ultra violet (EUV) lithography.
The RMDC is part of the College of Nanoscale Science and Engineering (CNSE) at the University at Albany. Fujifilm is planning to contribute to specific research areas such as minimization of line edge roughness (LER) in images that are below 22nm and testing imaging particles that are EUV sensitive and in new resist materials resolution.
Takahiro Goto, who is in charge of Electronic Materials Research Laboratories at Fujifilm, stated that the collaboration will enable Fujifilm to contribute towards the markets for semiconductor manufacturing and electronic materials. He assured that Fujifilm would deliver the materials and the processes that favour innovative developments at Sematech. John Warlaumont, the VP of Advanced Technologies at Sematech, was positive that the joint effort would enhance RMDC’s capabilities in handling critical resist issues in materials and also speed up Sematech’s quest for new solutions.
Sematech contribution to this partnership is backed with hardware and research experience in semiconductors and market leadership. Fuji film on the other hand brings in advanced semiconductor materials and related processes, which would make this partnership a fruitful one. Throughout the research work RMDC would provide Fuji film access to two micro-exposure tools and other metrology tools that are housed at the University of California, Berkeley and University at Albany’s College of Nanoscale Science and Engineering. Research at RMDC is focussed on developing EUV resist processes that adhere to strict specifications such as resolution, line width roughness and sensitivity specifications required for EUV insertion.
Source: http://fujifilm.jp/