Reportlinker.com has included a new report titled ‘MEMS Packaging’ to its offering.
According to the report, the market for MEMS packaging, assembly, test and calibration is expected to reach a value of $2.3 billion in 2016, a growth rate three folds faster when compared to the overall IC packaging industry.
The MEMS packaging market is estimated to grow 2x faster or roughly 20% CAGR when compared to the estimated value for the overall IC package market in terms of package unit shipments. WLP / TSV platform will experience the fastest growth, while organic laminate and leadframe based packages are expected to grow at a CAGR of 16% in the next five years.
Latest smartphone designs feature numerous MEMS products and sensors such as MEMS oscillators, RF switches, FBAR / BAW filters and duplexers, multiple silicon MEMS microphones, electronic compass magnetometers, pressure sensors, gyroscopes, and MEMS accelerometers, an indication of rapidly growing MEMS content over standard IC content.
The comprehensive report analyzes packaging, assembly and test prerequisites based on applications, and discusses MEMS package substrates, including leadframe, ceramic and organic laminates in detail. Packaging, assembling, testing and calibration stages represent roughly 35% to 60% of the cost of a total MEMS packaged module.
Major MEMS applications covered in the report include micro-actuator auto-focus, micro-displays, microfluidic & Biochips, ink-jet MEMS modules, SAW filters, FBAR/BAW filters, switches, oscillators and resonators, micro-bolometers, micro-mirrors, TPMS modules, pressure sensors, fusion sensor combo units and IMU, magnetometers, accelerometers, gyroscopes and silicon microphones, and much more.
Some of the companies mentioned in the report include VTI Technologies, Unimicron, TSMC, Triquint Semiconductor, Tong Hsing Electronics, Texas Instruments, Teramikros, Tecnisco, Silicon Sensing Systems, STMicroelectronics, Rood Microtec, Panasonic, PlanOptik, Melexis, MEM Hitech, Lemoptix, GE Sensing, DelfMEMS, Analog Devices, Amkor, Akustica, and AAC Acoustic Technologies.
Source: http://www.reportlinker.com