| Oxford Instruments’ FlexAL product family provides a new range of flexibility and capability in the engineering of nanoscale structures and devices by offering remote plasma Atomic Layer Deposition (ALD) processes and thermal ALD within a single system to deliver: · Maximum flexibility in the choice of materials and precursors · Low-temperature processes enabled by plasma ALD · Low damage maintained by the use of remote plasma · Controllable, repeatable processes via recipe-driven software interface Unique system benefits · Ability to handle from small wafer pieces up to full 200 mm wafers · Load-locked wafer entry for safety, low particle count and short loading-to-process-start time · Unique precursor delivery system offering precise precursor temperature control with fan-assisted oven and optimised heated delivery lines · Integral glove box on precursor modules for in-situ change-over · Integral ports to allow the addition of in-situ ellipsometry measurement tools. · Fits in compact space of less than 2 x 2 m even with maximum number of precursor modules · May be integrated in cluster system with other process tools, including Oxford Instruments Plasmalab®System100 range of etch and deposition tools · Backed by Oxford Instruments' global sales and support network; with platform technology based on the popular PlasmalabSystem100 process tool, the FlexAL product family benefits from proven reliability in over 300 installed systems worldwide · Developed in consultation with leading Atomic Layer Deposition (ALD) experts in Europe, Korea and USA · Licensed technology from ASM International NV Processes Standard processes available on the FlexAL systems include: · Al2O3 remote plasma process - down to room temperature deposition · HfO2 high-k dielectric remote plasma process · HfO2 high-k dielectric thermal ALD process · TiN remote plasma process Product range The FlexAL ALD product family consists of: · FlexALRP offering remote plasma ALD · FlexALRPT offering both remote plasma and thermal ALD in a single system to provide a wide choice of precursors and processes · FlexALRPX offering the widest range of precursor options within both remote plasma and thermal ALD, having the maximum number of precursor delivery modules and deposition temperatures up to 700 ºC %20Processes%20and%20Thermal%20ALD%20With%20The%20FlexALTM%20Atomic%20Layer_files/image002.jpg)
Figure 1. Conformal TiN coating by remote plasma Atomic Layer Deposition (ALD) %20Processes%20and%20Thermal%20ALD%20With%20The%20FlexALTM%20Atomic%20Layer_files/image003.jpg)
Figure 2. FlexAL ALD system |