Remote Plasma Atomic Layer Deposition (ALD) Processes and Thermal ALD With The FlexALTM Atomic Layer Deposition (ALD) Tool From Oxford Instruments

Topics Covered

Background

Unique system benefits

Processes

Product range

Background

Oxford Instruments’ FlexAL product family provides a new range of flexibility and capability in the engineering of nanoscale structures and devices by offering remote plasma Atomic Layer Deposition (ALD) processes and thermal ALD within a single system to deliver:

•        Maximum flexibility in the choice of materials and precursors

•        Low-temperature processes enabled by plasma ALD

•        Low damage maintained by the use of remote plasma

•        Controllable, repeatable processes via recipe-driven software interface

Unique system benefits

•        Ability to handle from small wafer pieces up to full 200 mm wafers

•        Load-locked wafer entry for safety, low particle count and short loading-to-process-start time

•        Unique precursor delivery system offering precise precursor temperature control with fan-assisted oven and optimised heated delivery lines

•        Integral glove box on precursor modules for in-situ change-over

•        Integral ports to allow the addition of in-situ ellipsometry measurement tools.

•        Fits in compact space of less than 2 x 2 m even with maximum number of precursor modules

•        May be integrated in cluster system with other process tools, including Oxford Instruments Plasmalab®System100 range of etch and deposition tools

•        Backed by Oxford Instruments' global sales and support network; with platform technology based on the popular PlasmalabSystem100 process tool, the FlexAL product family benefits from proven reliability in over 300 installed systems worldwide

•        Developed in consultation with leading Atomic Layer Deposition (ALD) experts in Europe, Korea and USA

•        Licensed technology from ASM International NV

Processes

Standard processes available on the FlexAL systems include:

•        Al2O3 remote plasma process - down to room temperature deposition

•        HfO2 high-k dielectric remote plasma process

•        HfO2 high-k dielectric thermal ALD process

•        TiN remote plasma process

Product range

The FlexAL ALD product family consists of:

•        FlexALRP offering remote plasma ALD

•        FlexALRPT offering both remote plasma and thermal ALD in a single system to provide a wide choice of precursors and processes

•        FlexALRPX offering the widest range of precursor options within both remote plasma and thermal ALD, having the maximum number of precursor delivery modules and deposition temperatures up to 700 ºC

AZoNano - The A to Z of Nanotechnology - Conformal TiN coating by remote plasma Atomic Layer Deposition (ALD)

Figure 1. Conformal TiN coating by remote plasma Atomic Layer Deposition (ALD)

AZoNano - The A to Z of Nanotechnology - FlexAL ALD system

Figure 2. FlexAL ALD system

Source: Oxford Instruments

For more information on this source please visit Oxford Instruments

 

Date Added: Oct 11, 2006 | Updated: Jun 11, 2013
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