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Wafer bonding is rapidly establishing itself as a pervasive technology in semiconductor manufacturing today. Wafer bonding is already a critical core competency for any high volume MEMS manufacturing operation – from accelerometers and gyros to silicon pressure sensors for automotive, biomedical, aerospace and consumer applications.
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Equipment
EVG540 Automated Wafer Bonding System is an automated single-chamber production bonder designed for pilot line and manufacturing as well as R&D for high volume manufacturing in Wafer Level Packaging, 3D-Interconnect and MEMS applications.
The SB6/8e is a semi-automatic, computer controlled, stand-alone wafer bonder accommodating 150mm and 200mm wafers respectively. The SB6/8e system features a rigid vacuum chamber for best-in-class post-bond alignment accuracy, independent upper and lower substrate heaters and precise programmable force control during the wafer bonding process.
The DXB is used for mounting wafer to substrate improves bond quality and repeatability while improving process time during lapping, polishing, or dicing.
The 3180 and 3190 are programmable wafer bonders offered by SST International for high-reliability bonding of silicon, gallium-arsenide and glass wafers up to 6 inches (150 mm) in diameter.