Plasma Cleaning Systems

Plasma cleaning involves the removal of impurities and contaminants from surfaces through the use of an energetic plasma created from gaseous species. Gases such as argon and oxygen, as well as mixtures such as air and hydrogen/nitrogen are used.

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Equipment

FlexTRAK-WF Plasma Treatment System from Nordson

The FlexTRAK-WF Plasma System is designed for high-throughput processing of semiconductor wafers (and other flat substrates) in sizes ranging from 3 in. to 200mm (8 in.) in diameter, for wafers held in open cassettes.

Microwave Plasma System - GIGAfab A by PVA TePla

The GIGAfab A is an extremely compact, high-performance, automatic Single Wafer Asher providing very low cost of ownership. It is designed to serve main stream semiconductor resist stripping, esp. hi-dose implanted resist, as well as MEMS-manufacturing and descum applications for wafer sizes up to 300 mm. Unique system characteristics like strong isotropy and high ash rates at moderate substrate temperatures make it a perfect tool for a wide range of wafer cleaning and stripping applications.

Loaded Magazine Cleaning System - YES-G1000LMC from Yield Engineering Systems

The YES-G1000LMC™ plasma cleaning system is designed for uniform cleaning of fully loaded lead frames and carrier born devices.

Ion Wave 10 Gas Plasma System by PVA TePla

The IoN Wave 10 plasma system is PVA Tepla's latest advancement in microwave plasma technology. This low cost, mid-sized wafer batch asher is designed with advanced features, targeting the needs of small scale foundries, universities and start-up companies.

Plasma Etcher-Asher-Cleaner - The K1050X from Quorum Technologies

The K1050X Plasma Etcher/Asher/Cleaner is a modern, solid-state RF plasma barrel reactor designed to meet the requirements of research and development and small-scale production for a wide and varied range of plasma etching, plasma ashing and plasma cleaning applications.

Gigabatch Series Microwave Plasma Systems by PVA TePla

The GIGAbatch series is the latest and most advanced generation of batch ashers offered today and is the successor of the very popular 300 series. Main use is resist removal and wafer cleaning.

IoN 100 Gas Plasma System by PVA TePla

The IoN 100 is our latest advancement in vacuum plasma technology. Gas plasma is fast becoming the technology of choice for surface modification of materials in the life sciences, electronic and industrial arenas due to its versatility and low impact to our environment. For example, the trend towards miniaturization in medical diagnostics requires precision cleaning, and selective chemical functionalization. Plasma removes organic contamination several orders of magnitude more efficiently than wet chemical processing and can chemically functionalize surfaces at the nano-scale. As a result, plasma is replacing older types of treatments that are no longer practical or economical.

Ion 40 Gas Plasma System by PVA TePla

The IoN 40 is our latest advancement in vacuum plasma technology. Gas plasma is fast becoming the technology of choice for surface modification of materials in the life sciences, electronic and industrial arenas due to its versatility and low impact to our environment. For example, the trend towards miniaturization in medical diagnostics requires precision cleaning, and selective chemical functionalization. Plasma removes organic contamination several orders of magnitude more efficiently than wet chemical processing and can chemically functionalize surfaces at the nano-scale. As a result, plasma is replacing older types of treatments that are no longer practical or economical.