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Plasma cleaning involves the removal of impurities and contaminants from surfaces through the use of an energetic plasma created from gaseous species. Gases such as argon and oxygen, as well as mixtures such as air and hydrogen/nitrogen are used.
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Equipment
The Evactron® EP De-Contaminator is the latest model in the E-series offered by XEI Scientific. The remote RF plasma cleaning system was specially built for people in the physics and materials science communities who develop and employ tailor-made vacuum systems.
The GIGAbatch series is the latest and most advanced generation of batch ashers offered today and is the successor of the very popular 300 series. Main use is resist removal and wafer cleaning.
The IoN 100 is our latest advancement in vacuum plasma technology. Gas plasma is fast becoming the technology of choice for surface modification of materials in the life sciences, electronic and industrial arenas due to its versatility and low impact to our environment. For example, the trend towards miniaturization in medical diagnostics requires precision cleaning, and selective chemical functionalization. Plasma removes organic contamination several orders of magnitude more efficiently than wet chemical processing and can chemically functionalize surfaces at the nano-scale. As a result, plasma is replacing older types of treatments that are no longer practical or economical.
The Evactron® SoftClean Chamber/Evactron combination pre-cleans specimens and specimen mounts with suspicious or known high levels of contamination before their introduction into your microscope chamber.
The IoN Wave 10 plasma system is PVA Tepla's latest advancement in microwave plasma technology. This low cost, mid-sized wafer batch asher is designed with advanced features, targeting the needs of small scale foundries, universities and start-up companies.
The rack mounted Evactron® DeContaminator models can be embedded into FIBs, SEMs and other vacuum systems offering system manufacturers the ability to integrate remote plasma cleaning capability.
The FlexTRAK-WF Plasma System is designed for high-throughput processing of semiconductor wafers (and other flat substrates) in sizes ranging from 3 in. to 200mm (8 in.) in diameter, for wafers held in open cassettes.
The Evactron® CombiClean system features an integrated vacuum chamber for desktop cleaning samples and vacuum parts, and also an external plasma radical source for Evactron in-situ cleaning of E-beam instruments such as SEMs, FIBs, and other analytic instruments by removing carbon contamination.
The Evactron® 25 De-Contaminator can be used to remove atmospheric hydrocarbons and carbon contamination from SEMs, FIBs, and other vacuum chambers. It makes use of a remote RF plasma to produce gas-phase radicals that flow downstream through the chamber, eliminating contamination.
The YES-G1000LMC™ plasma cleaning system is designed for uniform cleaning of fully loaded lead frames and carrier born devices.
The K1050X Plasma Etcher/Asher/Cleaner is a modern, solid-state RF plasma barrel reactor designed to meet the requirements of research and development and small-scale production for a wide and varied range of plasma etching, plasma ashing and plasma cleaning applications.
The IoN 40 is our latest advancement in vacuum plasma technology. Gas plasma is fast becoming the technology of choice for surface modification of materials in the life sciences, electronic and industrial arenas due to its versatility and low impact to our environment. For example, the trend towards miniaturization in medical diagnostics requires precision cleaning, and selective chemical functionalization. Plasma removes organic contamination several orders of magnitude more efficiently than wet chemical processing and can chemically functionalize surfaces at the nano-scale. As a result, plasma is replacing older types of treatments that are no longer practical or economical.
The GIGAfab A is an extremely compact, high-performance, automatic Single Wafer Asher providing very low cost of ownership. It is designed to serve main stream semiconductor resist stripping, esp. hi-dose implanted resist, as well as MEMS-manufacturing and descum applications for wafer sizes up to 300 mm. Unique system characteristics like strong isotropy and high ash rates at moderate substrate temperatures make it a perfect tool for a wide range of wafer cleaning and stripping applications.
The Evactron® 25Z Zephyr De-Contaminator from XEI Scientific is a user-friendly tabletop model capable of eliminating atmospheric carbon and hydrocarbons contamination from vacuum chambers such as focused ion beams and scanning electron microscopes.
XEI Scientific offers an innovative approach to plasma cleaning with the advanced Evactron® ES De-Contaminator. The ES model is ideal for system electron microscope manufacturers and OEMs. It can be easily started, thanks to patent-pending “POP” plasma ignition process.