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IBM's Microelectronics Business to be Acquired by GLOBALFOUNDRIES

IBM's Microelectronics Business to be Acquired by GLOBALFOUNDRIES

IBM and GLOBALFOUNDRIES today announced that they have signed a Definitive Agreement under which GLOBALFOUNDRIES plans to acquire IBM's global commercial semiconductor technology business, including intellectual property, world-class technologists and technologies related to IBM Microelectronics, subject to completion of applicable regulatory reviews. GLOBALFOUNDRIES will also become IBM's exclusive server processor semiconductor technology provider for 22 nanometer (nm), 14nm and 10nm semiconductors for the next 10 years. [More]
Computer Simulations Help Dispel Misconception about Mg-ion Batteries

Computer Simulations Help Dispel Misconception about Mg-ion Batteries

Lithium (Li)-ion batteries serve us well, powering our laptops, tablets, cell phones and a host of other gadgets and devices. However, for future automotive applications, we will need rechargeable batteries with significant increases in energy density, reductions in cost and improvements in safety. Hence the big push in the battery industry to develop an alternative to the Li-ion technology. [More]
Major Aviation Component Supplier Places $1.7 Million Order with CVD Equipment

Major Aviation Component Supplier Places $1.7 Million Order with CVD Equipment

CVD Equipment Corporation announced today that it has received a $1.7 million order for additional features to be incorporated into the multi-million dollar order we received earlier this year from a major aviation component supplier. [More]
Glasgow Nanofabrication Expert Honored with Institute of Physics President’s Medal

Glasgow Nanofabrication Expert Honored with Institute of Physics President’s Medal

Professor Douglas Paul received the Institute of Physics President’s Medal at an event in London today (Wednesday 15 October). [More]
Oxford Instruments Plasma Technology and IOP to Hold Webinar on Fabrication Technologies for 2D Materials

Oxford Instruments Plasma Technology and IOP to Hold Webinar on Fabrication Technologies for 2D Materials

One of the key technical challenges when working towards the commercial realisation of graphene and related 2D materials is the development of robust fabrication techniques for deposition, etching and integration with other processes in a device-fabrication facility. [More]
GMZ Energy Introduces Hafnium-Free P-type Half-Heusler Material

GMZ Energy Introduces Hafnium-Free P-type Half-Heusler Material

GMZ Energy, a leading provider of nano-structured high-temperature thermoelectric generation (“TEG”) power solutions, today announced its new Hafnium-free p-type half-Heusler material, which has substantially lower raw material cost than conventional half-Heusler materials. The material also features dramatically enhanced performance and mechanical strength due to GMZ’s patented nanostructuring process. [More]
Major Advance in Implementation of ETPN Nanomedicine Translation Hub

Major Advance in Implementation of ETPN Nanomedicine Translation Hub

A major step in implementing the ETPN Translation Hub has been reached, with three European projects entering the finalisation stage of their EU Grant Agreements. The project ENATRANS is for networking of SMEs in the nano-biomedical sector and supporting the SMEs with getting their products from the laboratory phase to the clinical applications. [More]
Tortech Nanofibres Installs Additional Capacity for Manufacture of Nonwoven Carbon Nanotube Sheets

Tortech Nanofibres Installs Additional Capacity for Manufacture of Nonwoven Carbon Nanotube Sheets

Tortech Nanofibres, a subsidiary of Plasan, today announces the installation of additional capacity for the manufacture of its nonwoven carbon nanotube (CNT) sheet at its manufacturing facility. This will more than triple output once full commissioning is completed in the next few months and is an important step towards a full scale industrial manufacturing capability. [More]
New Report on Lithography, Deposition, and Etch Market Analysis for Flip Chip/WLP Manufacturing

New Report on Lithography, Deposition, and Etch Market Analysis for Flip Chip/WLP Manufacturing

Flip chips are appearing in a plethora of high-volume consumer products such as mobile phones, digital cameras, MP3 players, and computer peripherals. Wafer-level packaging (WLP), the fabrication of the package directly on the wafer, is experiencing exceptional growth and stands out as one of the bright growth areas in electronics today. [More]
TSMC Honors Cadence with Partner of the Year Awards for Soft IP and 16nm FinFET Plus Solutions

TSMC Honors Cadence with Partner of the Year Awards for Soft IP and 16nm FinFET Plus Solutions

Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced that it has won two TSMC Partner of the Year awards during the TSMC Open Innovation Platform® (OIP) Ecosystem Forum. Cadence was presented with awards for both Soft IP and joint development of 16nm FinFET Plus (16FF+) design infrastructure. [More]