Nanofabrication News RSS Feed - Nanofabrication

AMD Enters Design IP Agreement with Synopsys for Advanced FinFET Process Technologies

AMD Enters Design IP Agreement with Synopsys for Advanced FinFET Process Technologies

Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems and AMD today announced they have signed a multi-year agreement that gives AMD access to a range of Synopsys DesignWare® interface, memory compiler, logic library and analog IP on advanced 16/14-nanometer (nm) and 10-nm FinFET process technologies. Synopsys is also hiring approximately 150 AMD IP R&D engineers and gains access to AMD's leading interface and foundation IP. [More]
NanoMech Secures Additional $12 Million in Capital for Series B Financing Round

NanoMech Secures Additional $12 Million in Capital for Series B Financing Round

NanoMech announced today that it has secured an additional $12 million in capital for its Series B Financing round, in order to continue growth and dominance as a global leading nanoscale manufacturer. [More]
US President Launches National Network for Manufacturing Innovation

US President Launches National Network for Manufacturing Innovation

The President of the United States has launched a major, new initiative focused on strengthening the innovation, performance, competitiveness, and job-creating power of U.S. manufacturing called the National Network for Manufacturing Innovation (NNMI). [More]
Samsung Commences Mass Production of 20nm 6Gb LPDDR3 DRAM

Samsung Commences Mass Production of 20nm 6Gb LPDDR3 DRAM

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it has begun mass producing its six gigabit (Gb) low-power double data rate 3 (LPDDR3) mobile DRAM, based on advanced 20 nanometer (nm) process technology. [More]
Veeco Reports Significant Milestone in Ion Beam Deposition Systems for EUV Photomasks

Veeco Reports Significant Milestone in Ion Beam Deposition Systems for EUV Photomasks

Veeco Instruments Inc. announced today that its new Odyssey™ Ion Beam Deposition (IBD) Upgrade for the NEXUS® IBD-LDD™ System has repeatedly produced photomask blanks with zero deposition defects larger than 70 nanometers. This represents a significant milestone toward the manufacture of semiconductor devices with advanced extreme ultraviolet (EUV) lithography. [More]
Leading Logic Manufacturer Selects Nova Optical CD Solution for 10nm, 7nm Technology Node Production

Leading Logic Manufacturer Selects Nova Optical CD Solution for 10nm, 7nm Technology Node Production

Nova Measuring Instruments, a leading innovator and a key provider of optical metrology solutions for advanced process control used in semiconductor manufacturing, announced today that a leading logic manufacturer selected Nova's Optical CD metrology solution to support the development and future manufacturing of its 10nm and 7nm technology nodes, covering both FEOL and BEOL applications in Litho, Etch, Deposition, CMP and Epi process steps. [More]
Nano-Bioreplicated Female Emerald Ash Borer Decoy Successfully Kills Males

Nano-Bioreplicated Female Emerald Ash Borer Decoy Successfully Kills Males

An international team of researchers has designed decoys that mimic female emerald ash borer beetles and successfully entice male emerald ash borers to land on them in an attempt to mate, only to be electrocuted and killed by high-voltage current. [More]
Semtech Announces Availability of 64GSPS ADC and DAC Cores Utilizing IBM’s 32nm SOI Technology

Semtech Announces Availability of 64GSPS ADC and DAC Cores Utilizing IBM’s 32nm SOI Technology

Semtech Corporation, a leading supplier of analog and mixed-signal semiconductors, today announced that 64GSPS ADC and DAC cores are available utilizing IBM’s 32nm SOI technology for integration in high performance Digital Microwave System on Chip (SoC) solutions. [More]
TSMC Announces Volume Production of 28-nm High Performance Compact Process

TSMC Announces Volume Production of 28-nm High Performance Compact Process

TSMC today announced its 28-nanometer High Performance Compact (28HPC) process is in volume production, making it the most power- and cost-efficient solution among all 28-nanometer technologies in the foundry segment. The achievement of this milestone demonstrates TSMC's commitment to providing industry-leading technology for customers looking to tap power and performance benefits in cost-effective SoC designs. [More]
Nanotechnology and Art at CCA 2014 Biennial

Nanotechnology and Art at CCA 2014 Biennial

For her newest work, Korean artist Kimsooja wanted to explore a “shape and perspective that reveals the invisible as visible, physical as immaterial, and vice versa.” [More]