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Researchers Create Unexpected Shapes of Mesoscale Atoms

Researchers Create Unexpected Shapes of Mesoscale Atoms

Unexpected shapes of mesoscale atoms -- structures built of microdroplets encapsulated within microdroplets -- have been created at the Institute of Physical Chemistry of the Polish Academy of Sciences in Warsaw, Poland. The discovery was possible with a new method for precise control over placement of tiny segments of liquid, one in another. With further progress in innovative microfluidic systems, the method may find use in medicine and materials science. [More]
Elionix Electron Beam Lithography System to be Installed at CUNY Advanced Science Research Center

Elionix Electron Beam Lithography System to be Installed at CUNY Advanced Science Research Center

SEMTech Solutions, in partnership with Elionix, is pleased to announce the delivery of a 100kV Electron Beam Lithography (EBL) system to the City University of New York’s (CUNY) Advanced Science Research Center (ASRC). [More]
Oxford Instruments CVD Equipment Used for Graphene and 2D Materials Research in Institutes Across Europe and US

Oxford Instruments CVD Equipment Used for Graphene and 2D Materials Research in Institutes Across Europe and US

As developments in graphene and 2D materials technology continue to increase, research institutes globally are investing in Oxford Instruments’ leading plasma processing Nanofab® equipment using CVD, PECVD and ICPCVD techniques to further their work in this important area. [More]
Awesome Con: NNCO & MOSF to Present Exciting Panels on Nanotechnology, 3D Printing

Awesome Con: NNCO & MOSF to Present Exciting Panels on Nanotechnology, 3D Printing

The National Nanotechnology Coordination Office (NNCO) and the Museum of Science Fiction (MOSF) have teamed up for this year's Awesome Con to present two exciting panels, Nanotechnology: Fact from Fiction and 3D Printing: "Replicating" Success. The purpose of these panels is to examine the intersection between science, technology, science fiction, and popular culture, and to discuss ways in which these new technologies will impact our lives. [More]
Applied Materials Introduces Breakthrough System for Patterning Copper Interconnects at 10nm

Applied Materials Introduces Breakthrough System for Patterning Copper Interconnects at 10nm

Applied Materials, Inc. today announced its Applied Endura® Cirrus(TM) HTX PVD* system with breakthrough technology for patterning copper interconnects at 10nm and beyond. As chip features continue to shrink, innovations in hardmask are required to preserve the pattern integrity of tightly packed, tiny interconnect structures. With the introduction of this technology, Applied enables scaling of the TiN* metal hardmask - the industry's material of choice - to meet the patterning needs of copper interconnects in advanced microchips. [More]
Attopsemi Adopts ProPlus Design Solutions' GigaSpice Simulator for Giga-Scale Circuit Simulation

Attopsemi Adopts ProPlus Design Solutions' GigaSpice Simulator for Giga-Scale Circuit Simulation

ProPlus Design Solutions, Inc. today announced Attopsemi Technology Co., of Hsinchu, Taiwan, developer of state-of-art logic-compatible one-time-programmable (OTP) memory intellectual property (IP), has adopted its high-capacity, high-performance parallel GigaSpice simulator for giga-scale circuit simulation. [More]
Altera Releases Industrial Functional Safety Data Package (Ver. 3) for FPGA Designs

Altera Releases Industrial Functional Safety Data Package (Ver. 3) for FPGA Designs

Altera Corporation today announced the availability of the latest version of its Industrial Functional Safety Data Package (Ver. 3), for systems designers using Altera field programmable gate arrays (FPGAs). The safety pack provides TUV Rheinland-certified toolflows, IP and devices including Cyclone V FPGAs, enabling faster time for market for industrial safety solutions to IEC 61508 up to Safety Integrity Level 3 (SIL3). [More]
Kyocera Introduces Nano-Silver Technology-Based Lead-Free, Pressureless Sinter Paste

Kyocera Introduces Nano-Silver Technology-Based Lead-Free, Pressureless Sinter Paste

Kyocera America, Inc., Chemical Sales Division, today announced the U.S. introduction of its environmentally-friendly XT2773R7 Silver Sinter Paste, a proprietary formulation specifically developed to deliver a wider range of benefits and performance characteristics compared to high-lead solders. [More]
X-FAB Partners with Exagan to Industrialize Technology for GaN-on-Silicon Devices on 200mm Wafers

X-FAB Partners with Exagan to Industrialize Technology for GaN-on-Silicon Devices on 200mm Wafers

X-FAB Silicon Foundries and Exagan, a start-up innovator of Gallium Nitride (GaN) semiconductor technology that enables smaller and more efficient electrical converters, have entered into a joint development agreement to industrialize Exagan’s GaN-on-silicon technology, begin producing high-speed power switching devices on 200mm wafers and establish a European production center where the two partner companies will manufacture GaN devices for the solar, industrial, automotive, IT electronics and other markets. [More]
CAP-XX Introduces Thinline Supercapacitors with Unique Nanotechnology Construction

CAP-XX Introduces Thinline Supercapacitors with Unique Nanotechnology Construction

CAP-XX, developer of flat supercapacitors for burst and back-up power in space-constrained electronic devices, today launched its Thinline series of single-cell supercapacitors. The world's thinnest at 0.6mm thick, and with prices starting at less than US$1 in large volumes, Thinline was developed to address the size, weight and cost challenges of designing thin, sometimes disposable electronic devices for the Internet of Things (IoT). [More]
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