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Renesas Electronics Develops New Circuit Technology for Automotive Information SoCs at 16nm

Renesas Electronics Develops New Circuit Technology for Automotive Information SoCs at 16nm

Renesas Electronics Corporation, a premier provider of advanced semiconductor solutions, today announced the development of a new circuit technology for automotive information SoCs (system on chips) at 16 nanometer (nm) and beyond. [More]
Quad-Core Silicon Built Around ARM Cortex-A17 Processor Implemented Using GLOBALFOUNDRIES’ 28nm-SLP Process Delivered

Quad-Core Silicon Built Around ARM Cortex-A17 Processor Implemented Using GLOBALFOUNDRIES’ 28nm-SLP Process Delivered

Cadence Design Systems, Inc., a leader in global electronic design innovation, and GLOBALFOUNDRIES, a leading provider of advanced semiconductor manufacturing technology, today announced the delivery of quad-core silicon built around the ARM® Cortex®-A17 processor implemented using GLOBALFOUNDRIES’ 28nm Super Low Power (28nm-SLP) process with High-k Metal Gate (HKMG) technology. [More]
Atomic Force Microscopy Etches Nanoscale Patterns on Conductive Polymers

Atomic Force Microscopy Etches Nanoscale Patterns on Conductive Polymers

Researchers at Oak Ridge National Laboratory (ORNL) have successfully carved out nanoscale designs on polymer surfaces using atomic force microscopy (AFM). [More]
Synopsys Expands Collaboration with Nanoelectronics Research Center imec

Synopsys Expands Collaboration with Nanoelectronics Research Center imec

Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced the expansion of its collaboration with nanoelectronics research center imec to nanowire and other devices (FinFETs, Tunnel-FETs) targeting the 5-nanometer (nm) technology node and beyond. [More]
Oxford Instruments Report Successful Nanotechnology Seminars in Delhi, Kolkata

Oxford Instruments Report Successful Nanotechnology Seminars in Delhi, Kolkata

Oxford Instruments and IIT Delhi were honoured by the attendance and enlightening inaugural talk that was given by Dr. Chidambaram, Principal Scientific Advisor to the Government of India at the start of the Oxford Instruments two day technical seminar held at IIT Delhi at the end of November. [More]
SMIC Commences Operations at Shenzhen 200mm Wafer Fab

SMIC Commences Operations at Shenzhen 200mm Wafer Fab

Semiconductor Manufacturing International Corporation, the largest and most advanced pure-play foundry provider in China, announced today it has begun operations at its Shenzhen 200mm wafer fab. This fab is the first 8-inch production line to be put into operation in Southern China, and is also the first domestic IC production line to be launched after the 'National Outline of Promoting the Development of IC Industry' was issued this year. [More]
Amkor Grants GLOBALFOUNDRIES Non-Exclusive License to Copper Pillar Wafer Bump Technology

Amkor Grants GLOBALFOUNDRIES Non-Exclusive License to Copper Pillar Wafer Bump Technology

Amkor Technology, Inc., a leading provider of semiconductor assembly and test services, today announced that it has granted GLOBALFOUNDRIES a non-exclusive license to its proprietary copper pillar wafer bump technology. [More]
Toshiba’s 4TC7734FTG Power Management IC Adopts 130nm Analog Semiconductor Process

Toshiba’s 4TC7734FTG Power Management IC Adopts 130nm Analog Semiconductor Process

Toshiba America Electronic Components, Inc. (TAEC), a committed leader that collaborates with technology companies to create breakthrough designs, today announced a new system power management IC (PMIC) designed to help optimize power management functions for a wide range of mobile products. [More]
UofL Micro/Nano Technology Center Founding Director Named Fellow of the National Academy of Inventors

UofL Micro/Nano Technology Center Founding Director Named Fellow of the National Academy of Inventors

Two researchers at the University of Louisville today were named Fellows of the National Academy of Inventors (NAI). [More]
Broadcom Introduces 28nm Physical Layer Transceivers that Support 2.5G and 5G Ethernet

Broadcom Introduces 28nm Physical Layer Transceivers that Support 2.5G and 5G Ethernet

Broadcom Corporation, a global innovation leader in semiconductor solutions for wired and wireless communications, today announced a new series of physical layer transceivers (PHYs) supporting 2.5G and 5G Ethernet speeds. [More]