Nanofabrication News

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EVG Installs 500th Bond Chamber and 100th Automated Wafer Bonder for High Volume MEMS Manufacturing Environments

EV Group (EVG), a leading supplier of wafer-bonding and lithography equipment for the advanced semiconductor and packaging, MEMS, silicon-on-insulator (SOI) and emerging nanotechnology markets, today announced it has suc...

5 Nov 2007

Micromen MRAM Production a Step Closer to Commercialisation

Micromem and Global Communication Semiconductors, Inc. (GCS) have successfully patterned and processed our own magnetic yoke design. This is significant in that this production- level process produced an extremely clean ...

2 Nov 2007

ORNL's Ho Nyung Lee Cited as Top Early Career Scientist

Oak Ridge National Laboratory researcher Ho Nyung Lee is one of eight Department of Energy scientists to receive the Presidential Early Career Award for Scientists and Engineers (PECASE). The award, one of the nation&...

2 Nov 2007

Veeco Wins Contract to Supply Two Metal Organic Chemical Vapor Deposition Systems

Veeco Instruments Inc., announced today that two recently purchased TurboDisc(R) E450(TM) As/P Metal Organic Chemical Vapor Deposition (MOCVD) Systems are being used by Xiamen Sanan OptoElectronics of Xiamen, China to ex...

1 Nov 2007

Cell Tractor Beam Could Be Used to Manipulate Tiny Things on Chips

In a feat that seems like something out of a microscopic version of Star Trek, MIT researchers have found a way to use a “tractor beam” of light to pick up, hold, and move around individual cells and other ob...

31 Oct 2007

SEMATECH Advances Infrastructure for Extreme Ultraviolet Lithography (EUVL)

SEMATECH engineers have made significant advances in moving forward the infrastructure that will prepare extreme ultraviolet lithography (EUVL) for cost-effective manufacturing, according to papers being presented here a...

From SEMATECH 30 Oct 2007

Research Begun on Next Generation DRAM MIMCAP (Metal Insulator Metal Capacitors) Process Technology

IMEC launches research on next-generation DRAM MIMCAP (metal-insulator-metal capacitors) process technology as part of its (sub-)32nm CMOS device scaling program. This research will enable IMEC and its partners to addres...

17 Oct 2007

IMEC Launches Research on Next Generation DRAM MIMCAP

From IMEC 16 Oct 2007

SMI Receives SBIR Phase II Funding to Develop Dielectrics for SiC MOSFET Devices

There is a world-wide need for improved devices used in conjunction with high-power, high-temperature applications, as well as in detectors and instrumentation in high energy physics applications. Silicon carbide (SiC) b...

15 Oct 2007

Sol Gel Inks can be Used to Create 3D Nanoscale Printing

New sol-gel inks developed by researchers at the University of Illinois can be printed into patterns to produce three-dimensional structures of metal oxides with nanoscale features. The ability to directly pattern fun...

12 Oct 2007