Nanoelectronics News RSS Feed - Nanoelectronics

Plastic Logic Adopts Synopsys' IC Validator for Physical Verification of Organic Thin Film Transistor Technology

Plastic Logic Adopts Synopsys' IC Validator for Physical Verification of Organic Thin Film Transistor Technology

Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, and Plastic Logic, a world leader in plastic electronics, today announced that Plastic Logic has adopted Synopsys' IC Validator product for physical verification of Plastic Logic's proprietary organic thin film transistor technology. [More]
ON Semiconductor and ICs to Market RHBD ASICs Created using 110nm Process

ON Semiconductor and ICs to Market RHBD ASICs Created using 110nm Process

ON Semiconductor, driving energy efficiency innovations, has entered into a licensing/development agreement with ICs LLC in order to bring application specific integrated circuits (ASICs) to market which are resilient to radiation effects. [More]
Nanoreactor Model Reveals Complex Chemical Reactions of Urey-Miller Experiment

Nanoreactor Model Reveals Complex Chemical Reactions of Urey-Miller Experiment

Chemists from Stanford University have developed a computer model that could provide details on the chemical reactions taking place during the Urey-Miller experiment besides determining the possible products of the experiments. The model has been termed as the nanoreactor and enables scientists to determine mechanisms or reactions revealing the possibilities of new drug formation or improving the battery or fuel combustion efficiency. [More]
XENON to Demonstrate S-2300 Dual Stage Sintering System at Printed Electronics USA

XENON to Demonstrate S-2300 Dual Stage Sintering System at Printed Electronics USA

XENON Corporation, world leader in Pulsed Light solutions, has announced it will be demonstrating its new S-2300 Dual Stage Sintering System at Printed Electronics USA in Santa Clara, California this November 19 and 20. [More]
New Report Covers Benchmarking Corporate Activity in Printed, Flexible, and Organic Electronics

New Report Covers Benchmarking Corporate Activity in Printed, Flexible, and Organic Electronics

Samsung, Merck, BASF, Sony and Philips are the world's leading innovators in printed, flexible and organic electronics (PFOE), according to Lux Research, which rated corporations based on both internal R&D spending and open innovation activities. Samsung Electronics is the standout with estimated PFOE R&D spending of $1.2 billion, as well as high open innovation scores due to its extensive outside partnerships and investments. [More]
UT Dallas and UC Berkeley Professors Recognized for Contributions to Semiconductor Research

UT Dallas and UC Berkeley Professors Recognized for Contributions to Semiconductor Research

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design – in consultation with Semiconductor Research Corporation (SRC) – today presented its University Research Award to professors from University of California, Berkeley and University of Texas at Dallas in recognition of their outstanding contributions to semiconductor research. [More]
Researchers Receive Grant to Further Develop New Material for Advanced Electronics

Researchers Receive Grant to Further Develop New Material for Advanced Electronics

Engineering researchers at the University of Arkansas and their colleague at the University of Arkansas at Pine Bluff have received a $725,000 grant from the U.S. Air Force Office of Scientific Research to further develop a new material for advanced electronics devices. [More]
Forecast Report on Global Market for Flexible, Printed and Thin Film Batteries

Forecast Report on Global Market for Flexible, Printed and Thin Film Batteries

Research and Markets has announced the addition of the "Flexible, Printed and Thin Film Batteries 2015-2025: Technologies, Forecasts, Players" report to their offering. [More]
TSMC Announces 16nm FinFET Plus Process in Risk Production

TSMC Announces 16nm FinFET Plus Process in Risk Production

TSMC today announced its 16-nanometer FinFET Plus (16FF+) process is now in risk production. This enhanced version of TSMC's 16FF process operates 40% faster than the company's planar 20-nanometer system-on-chip (20SoC) process, or consumes 50% less power at the same speed. It offers customers a new level of performance and power optimization targeted at the next generation of high-end mobile, computing, networking, and consumer applications. [More]
Forecast Report on Global Markets for Stretchable Electrics and Electronics

Forecast Report on Global Markets for Stretchable Electrics and Electronics

Stretchable electronics concerns electrical and electronic circuits and combinations of these that are elastically or inelastically stretchable by more than a few percent while retaining function. [More]