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TowerJazz and Physical Logic Report Milestone in Mass Production of MEMS-Based Accelerometer Family

TowerJazz and Physical Logic Report Milestone in Mass Production of MEMS-Based Accelerometer Family

TowerJazz, the global specialty foundry leader, and Physical Logic Ltd., a developer of MEMS-based sensor applications, announced today a milestone achievement for mass production of its first generation high performance MEMS-based accelerometer family (MAXL-OL-2000). [More]
Vantage Health Enters into Strategic Partnership with Theranostics Laboratory

Vantage Health Enters into Strategic Partnership with Theranostics Laboratory

Vantage Health Inc., ("Vantage Health") or (the "Company") today announced that it has entered into a strategic partnership with Theranostics Laboratory, a translational research company, with offices in the USA and New Zealand. [More]
Kilopass Successfully Ports OTP NVM Technology to TSMC's 16nm FinFET Process

Kilopass Successfully Ports OTP NVM Technology to TSMC's 16nm FinFET Process

Kilopass Technology Inc., a leading provider of semiconductor logic embedded non-volatile memory (eNVM) intellectual property (IP), announced today that it has successfully ported its one-time programmable (OTP) NVM technology to TSMC's 16 nanometer (nm) FinFET process. [More]
Synopsys IC Complier II Tool Enables Panasonic to Achieve Silicon Success with High-End Multimedia Chip

Synopsys IC Complier II Tool Enables Panasonic to Achieve Silicon Success with High-End Multimedia Chip

Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced that its IC Complier™ II place-and-route tool enabled Panasonic Corporation System LSI Business Division (Panasonic SoC) to achieve silicon success with their high-end multimedia chip. [More]
Everspin, GLOBALFOUNDRIES Collaborate to Build Fully Processed 300mm Wafers with MTJ ST-MRAM Technology

Everspin, GLOBALFOUNDRIES Collaborate to Build Fully Processed 300mm Wafers with MTJ ST-MRAM Technology

Everspin Technologies, Inc., the world's leading developer and manufacturer of discrete and embedded MRAM, today announced that the company has partnered with GLOBALFOUNDRIES to build fully processed 300mm wafers with Everspin’s magnetic tunnel junction (MTJ) Spin-Torque Magnetoresistive Random-Access Memory (ST-MRAM) technology, starting with GLOBALFOUNDRIES 40 nanometer and 28 nanometer Low Power CMOS platforms. [More]
Maxscend Bluetooth RF IP Silicon Proven on SMIC's 55nm Low Leakage Logic Process

Maxscend Bluetooth RF IP Silicon Proven on SMIC's 55nm Low Leakage Logic Process

Semiconductor Manufacturing International Corporation ("SMIC") and Maxscend Technologies Inc., a RF IP company based in China, announced that Maxscend Bluetooth RF IP has been silicon proven on SMIC's 55nm Low Leakage (LL) logic process. This IP has now been integrated into one of SMIC customers' product tape-out. [More]
Telecom Engineer Designs New Devices Based on Metamaterials

Telecom Engineer Designs New Devices Based on Metamaterials

Víctor Torres Landivar, Telecommunications engineer, has designed and manufactured new devices based on metamaterials (artificial materials with properties not found in nature). On drawing up his PhD, defended at the Public University of Navarre (UPNA), he achieved the first experimental demonstration ever with epsilon-near-zero (ENZ) metamaterials. [More]
Aehr Test Systems to Debut FOX-1P Single Wafer Test System at 2014 ITC

Aehr Test Systems to Debut FOX-1P Single Wafer Test System at 2014 ITC

Aehr Test Systems, a worldwide supplier of semiconductor test and burn-in equipment, today announced that it is introducing the FOX-1P system, its next generation single wafer test system for high volume production and early failure rate (EFR) test, at the 2014 International Test Conference (ITC) taking place October 21-23 in Seattle, Washington at the Washington State Convention Center (Booth #515). [More]
Cadence Helps GUC Complete First Production Design on TSMC’s 16nm FinFET Plus Process

Cadence Helps GUC Complete First Production Design on TSMC’s 16nm FinFET Plus Process

Cadence Design Systems, Inc., a leader in global electronic design innovation, and Global Unichip Corporation (GUC), the Flexible ASIC LeaderTM, today announced that GUC used the Cadence® Encounter® Digital Implementation System to tape out its first production high performance computation ASIC design on TSMC’s 16nm FinFET Plus (16FF+) process. [More]
Samsung Electronics Mass Produces 20nm 8Gb DDR4 DRAM

Samsung Electronics Mass Produces 20nm 8Gb DDR4 DRAM

Samsung Electronics Co., Ltd., the world leader in memory technology, today announced that it is mass producing the industry’s most advanced 8-gigabit (Gb) DDR4 memory and 32-gigabyte (GB) module, both of which will be manufactured based on a new 20-nanometer (nm) process technology, for use in enterprise servers. [More]