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Veeco Announces Shipment of 50th TurboDisc EPIK700 GaN MOCVD System Reactor

Veeco Announces Shipment of 50th TurboDisc EPIK700 GaN MOCVD System Reactor

Veeco Instruments Inc. announced today that it has shipped the 50th TurboDisc® EPIK™700 GaN Metal Organic Chemical Vapor Deposition (MOCVD) System reactor since its introduction ten months ago. [More]
Synopsys DesignWare IP on TSMC 16-nm FinFET Plus Process Achieves Certification from Multiple Standard Organizations

Synopsys DesignWare IP on TSMC 16-nm FinFET Plus Process Achieves Certification from Multiple Standard Organizations

Synopsys, Inc., today announced that it has achieved certification and compliance from multiple standard organizations for a broad range of DesignWare® IP on the TSMC 16-nm FinFET Plus (16FF+) process including USB 2.0 and USB 3.0, PCI Express® 3.1, HDMI 2.0, MIPI® D-PHYSM and Serial ATA (SATA™) IP solutions. [More]
Tanaka Precious Metals Launches RAD-Plater, Cup-Type, Ultra-Compact Plating Laboratory Equipment for Semiconductor Wafers

Tanaka Precious Metals Launches RAD-Plater, Cup-Type, Ultra-Compact Plating Laboratory Equipment for Semiconductor Wafers

Tanaka Holdings Co., Ltd. today announced that Electroplating Engineers of Japan, Limited, which operates the Tanaka Precious Metals’ plating business, has developed, and launched from July 15, the RAD-Plater cup-type1 ultra-compact plating laboratory equipment for semiconductor wafers, which achieves equivalent films to mass-production machines. [More]
New Report on Barrier Layers for Flexible Electronics

New Report on Barrier Layers for Flexible Electronics

Research and Markets has announced the addition of the "Barrier Layers for Flexible Electronics 2015-2025: Technologies, Markets, Forecasts" report to their offering. [More]
Department of Defense Honors Pitt’s Reconfigurable Nanoelectronics Pioneer as NSSEFF Fellow

Department of Defense Honors Pitt’s Reconfigurable Nanoelectronics Pioneer as NSSEFF Fellow

The U.S. Department of Defense recently selected University of Pittsburgh professor Jeremy Levy as one of seven distinguished university faculty scientists and engineers forming the next new class of National Security Science and Engineering Faculty Fellows (NSSEFF). [More]
Carbon Ion Implantation Technique Allows Direct Synthesis of Wafer-Scale Graphene in Silicon Microelectronics

Carbon Ion Implantation Technique Allows Direct Synthesis of Wafer-Scale Graphene in Silicon Microelectronics

A team of researchers from Korea University, Seoul, has developed an easy and scalable technique for growing graphene, and have synthetically produced high-quality, multi-layer, wafer-scale graphene on silicon substrates. This latest breakthrough paves the way for using graphene in silicon microelectronics on a commercial scale. [More]
Renesas Electronics Debuts Two New Series of Advanced Low Power SRAM Fabricated Using 110nm Process

Renesas Electronics Debuts Two New Series of Advanced Low Power SRAM Fabricated Using 110nm Process

Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced the release of two new series of Advanced Low Power SRAM (Advanced LP SRAM), the leading type of low-power-consumption SRAM, designed to provide enhanced reliability and longer backup battery life for applications such as factory automation (FA), industrial equipment, and the smart grid. [More]
ProPlus Design Solutions’ SPICE Simulator Selected by eSilicon for 28/16nm IP Designs

ProPlus Design Solutions’ SPICE Simulator Selected by eSilicon for 28/16nm IP Designs

ProPlus Design Solutions, Inc. today announced that eSilicon Corporation, a leading independent semiconductor design and manufacturing solutions provider, has selected its high-performance parallel SPICE simulator and its variation analysis platform for advanced intellectual property (IP) designs at 28-nanometer (nm), 16nm and beyond. [More]
Xilinx Offers Vivado Design Suite Early Access Support for 16nm UltraScale+ Portfolio

Xilinx Offers Vivado Design Suite Early Access Support for 16nm UltraScale+ Portfolio

Xilinx, Inc. today announced Vivado® Design Suite early access support for the 16nm UltraScale+™ portfolio, including Zynq® UltraScale+ and Kintex® UltraScale+ devices. The Vivado early access release has been co-optimized with the UltraScale+ ASIC-class programmable logic to exploit the full advantages of production UltraScale+ devices, leveraging the complete catalog of SmartCORE™ and LogiCORE™ IP. [More]
Novel Method for Growing 'Hybrid' Crystals at Nanoscale

Novel Method for Growing 'Hybrid' Crystals at Nanoscale

Researchers have developed an innovative technique that makes it possible to self-organize and customize complicated structures at the nanoscale. This breakthrough was facilitated through an international collaboration headed by IBM and the University of Cambridge. The study paves the way to customize material properties and functionalities for a variety of semiconductor device applications. [More]