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Park and imec Partner to Develop Nanoscale AFM Metrology Solutions for Semiconductor Wafer Production

Park and imec Partner to Develop Nanoscale AFM Metrology Solutions for Semiconductor Wafer Production

Park Systems, world-leader in Atomic Force Microscopes (AFM) announced today they have signed a Joint Development Project (JDP) with nanoelectronics research center imec, to develop in-line AFM metrology solutions of future technology nodes including but not limited to surface roughness, thickness, critical dimension (CD), and sidewall roughness. [More]
SUNY Poly CNSE and Israel’s Metro450 Consortium Partner to Develop Standard Calibration Wafers

SUNY Poly CNSE and Israel’s Metro450 Consortium Partner to Develop Standard Calibration Wafers

Supporting Governor Andrew M. Cuomo's vision for New York State's continued leadership in the global high-tech economy, SUNY Polytechnic Institute’s Colleges of Nanoscale Science and Engineering (SUNY Poly CNSE) and Israel’s Metro450 consortium today jointly announced plans to develop and produce Standard Calibration Wafers (SCW) for use with 300mm and 450mm metrology and process tools. The initiative will generate $2.9 million in investment and support more than 100 jobs in New York and Israel. [More]
Toshiba Develops STT-MRAM Circuit for High-Performance Processors and SoC Integrated Circuits

Toshiba Develops STT-MRAM Circuit for High-Performance Processors and SoC Integrated Circuits

We have developed a spin-transfer torque magnetoresistive random-access memory (STT-MRAM) circuit for use in high-performance processors and system-on-a-chip (SoC) integrated circuits, implementing a 1-Mb class of new magnetic materials. The newly developed memory circuit allows low-power, high-efficiency, high-speed performance in energy-efficient magnetic tunnel junction (MTJ) memory. [More]
New Hybrid, Transparent Materials Made of Silver Nanowires and Conductive Polymers

New Hybrid, Transparent Materials Made of Silver Nanowires and Conductive Polymers

Cambrios Technologies Corporation, the leader in silver nanowire-based solutions for the transparent conductor markets and Heraeus, the leader in conductive polymer technology, today announced a new class of hybrid, transparent, conductive materials made of silver nanowires and conductive polymers. [More]
SanDisk Introduces iNAND 7132 Solution with 1Y Nanometer 3-Bit-Per-Cell (X3) NAND Flash Storage

SanDisk Introduces iNAND 7132 Solution with 1Y Nanometer 3-Bit-Per-Cell (X3) NAND Flash Storage

MOBILE WORLD CONGRESS 2015 – SanDisk Corporation, a global leader in flash storage solutions, today introduced the iNAND®7132 storage solution, the most advanced embedded storage solution from SanDisk to date. [More]
Global Market for Printed, Flexible and Organic Electronics to Grow to $73.69 Billion in 2025

Global Market for Printed, Flexible and Organic Electronics to Grow to $73.69 Billion in 2025

Research and Markets has announced the addition of the "Printed, Organic & Flexible Electronics Forecasts, Players & Opportunities 2015-2025" report to their offering. [More]
Analog Bits Joins PLDA’s Ecosystem of PHY Partners

Analog Bits Joins PLDA’s Ecosystem of PHY Partners

PLDA, the industry leader in PCI Express® IP solutions has added Analog Bits, the semiconductor industry’s leading provider of mixed-signal IP, to its ecosystem of PHY partners. Together, the partners have developed a silicon-proven PCIe Gen 3 solution for a leading 28nm low-power process node that offers ASIC engineers great power savings and improved performance. [More]
2D-NANOLATTICES Project Makes Further Progress Towards Miniaturisation of Nanoelectronics

2D-NANOLATTICES Project Makes Further Progress Towards Miniaturisation of Nanoelectronics

A European research project has made an important step towards the further miniaturisation of nanoelectronics, using a highly-promising new material called silicene. Its goal: to make devices of the future vastly more powerful and energy efficient. [More]
Cadence’s Solutions Help Brite Semiconductor Achieve Better Results for 28nm SOC Designs

Cadence’s Solutions Help Brite Semiconductor Achieve Better Results for 28nm SOC Designs

Cadence Design Systems, Inc., today announced that Brite Semiconductor Corporation, used Cadence® digital implementation and signoff tools to complete four 28nm system-on-chip (SoC) designs and reduced their time to market by three weeks compared to previous design methodologies. By using Cadence tools, Brite Semiconductor was also able to increase performance by up to 20 percent and reduce power consumption by up to 10 percent on these designs. [More]
ISSCC 2015 Features Demonstration of imec’s Wavelength-Division Multiplexing CMOS Silicon Photonics Transceiver

ISSCC 2015 Features Demonstration of imec’s Wavelength-Division Multiplexing CMOS Silicon Photonics Transceiver

Today, at the 2015 International Solid State Circuits Conference (ISSCC), nanoelectronics research center imec, in collaboration with Tyndall National Institute, the University of Leuven (KULeuven) and the Ghent University, demonstrated a 4x20Gb/s wavelength division multiplexing (WDM) hybrid CMOS silicon photonics transceiver, paving the way to cost-effective, high-density single-mode optical fiber links. [More]
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