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Samtec Joins Silicon Photonics Program of the IRT Consortium

Samtec Joins Silicon Photonics Program of the IRT Consortium

Samtec, Inc., an industry-leading supplier of high-speed interconnects, microelectronics, and micro-optical solutions, is pleased to announce its entrance in the Silicon Photonics Program of the IRT Nanoelec, headed by CEA-Leti. Samtec is joining CNRS, STMicroelectronics, Mentor Graphics and CEA-Leti to develop and industrialize optical communications solutions using silicon photonics technology for addressing data centers and high-performance computing applications. [More]
Bendable, Light-Emitting Nanocellulose Paper Infused with Biocompatible Quantum Dots

Bendable, Light-Emitting Nanocellulose Paper Infused with Biocompatible Quantum Dots

The rapid evolution of gadgets has brought us an impressive array of "smart" products from phones to tablets, and now watches and glasses. But they still haven't broken free from their rigid form. Now scientists are reporting in the journal ACS Applied Materials & Interfaces a new step toward bendable electronics. They have developed the first light-emitting, transparent and flexible paper out of environmentally friendly materials via a simple, suction-filtration method. [More]
Nanotronics Imaging Completes Acquisition of Franklin Mechanical & Control

Nanotronics Imaging Completes Acquisition of Franklin Mechanical & Control

Nanotronics Imaging, developer of the world’s most technologically advanced nanoimaging solutions, today announced that it has completed its acquisition of Franklin Mechanical & Control, Inc. (Franklin MCI), a Hollister, California-based manufacturer of advanced mechanical and optical equipment. Through this acquisition, Nanotronics will incorporate Franklin MCI as a unique manufacturing division known as Nanotronics Automation offering customers a fully integrated suite of hardware prototyping, production services, and solutions. [More]
Applied Materials Introduces Breakthrough System for Patterning Copper Interconnects at 10nm

Applied Materials Introduces Breakthrough System for Patterning Copper Interconnects at 10nm

Applied Materials, Inc. today announced its Applied Endura® Cirrus(TM) HTX PVD* system with breakthrough technology for patterning copper interconnects at 10nm and beyond. As chip features continue to shrink, innovations in hardmask are required to preserve the pattern integrity of tightly packed, tiny interconnect structures. With the introduction of this technology, Applied enables scaling of the TiN* metal hardmask - the industry's material of choice - to meet the patterning needs of copper interconnects in advanced microchips. [More]
Attopsemi Adopts ProPlus Design Solutions' GigaSpice Simulator for Giga-Scale Circuit Simulation

Attopsemi Adopts ProPlus Design Solutions' GigaSpice Simulator for Giga-Scale Circuit Simulation

ProPlus Design Solutions, Inc. today announced Attopsemi Technology Co., of Hsinchu, Taiwan, developer of state-of-art logic-compatible one-time-programmable (OTP) memory intellectual property (IP), has adopted its high-capacity, high-performance parallel GigaSpice simulator for giga-scale circuit simulation. [More]
Altera Releases Industrial Functional Safety Data Package (Ver. 3) for FPGA Designs

Altera Releases Industrial Functional Safety Data Package (Ver. 3) for FPGA Designs

Altera Corporation today announced the availability of the latest version of its Industrial Functional Safety Data Package (Ver. 3), for systems designers using Altera field programmable gate arrays (FPGAs). The safety pack provides TUV Rheinland-certified toolflows, IP and devices including Cyclone V FPGAs, enabling faster time for market for industrial safety solutions to IEC 61508 up to Safety Integrity Level 3 (SIL3). [More]
X-FAB Partners with Exagan to Industrialize Technology for GaN-on-Silicon Devices on 200mm Wafers

X-FAB Partners with Exagan to Industrialize Technology for GaN-on-Silicon Devices on 200mm Wafers

X-FAB Silicon Foundries and Exagan, a start-up innovator of Gallium Nitride (GaN) semiconductor technology that enables smaller and more efficient electrical converters, have entered into a joint development agreement to industrialize Exagan’s GaN-on-silicon technology, begin producing high-speed power switching devices on 200mm wafers and establish a European production center where the two partner companies will manufacture GaN devices for the solar, industrial, automotive, IT electronics and other markets. [More]
CAP-XX Introduces Thinline Supercapacitors with Unique Nanotechnology Construction

CAP-XX Introduces Thinline Supercapacitors with Unique Nanotechnology Construction

CAP-XX, developer of flat supercapacitors for burst and back-up power in space-constrained electronic devices, today launched its Thinline series of single-cell supercapacitors. The world's thinnest at 0.6mm thick, and with prices starting at less than US$1 in large volumes, Thinline was developed to address the size, weight and cost challenges of designing thin, sometimes disposable electronic devices for the Internet of Things (IoT). [More]
ARM and UMC Offer Artisan Physical IP Solution on 55nm

ARM and UMC Offer Artisan Physical IP Solution on 55nm

ARM and United Microelectronics Corporation ("UMC"), a leading global semiconductor foundry, today announced the availability of a new ARM® Artisan® physical IP solution on 55nm to accelerate the development of ARM processor-based embedded systems and Internet of Things (IoT) applications. [More]
Ultra-Low Power Sensor Monitors Health Using Nano-Transistors

Ultra-Low Power Sensor Monitors Health Using Nano-Transistors

Made from state-of-the-art silicon transistors, an ultra-low power sensor enables real-time scanning of the contents of liquids such as perspiration. Compatible with advanced electronics, this technology boasts exceptional accuracy – enough to manufacture mobile sensors that monitor health. [More]
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