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Forecast & Analysis Report on Worldwide Internet of Nano Things Market

Forecast & Analysis Report on Worldwide Internet of Nano Things Market

According to new market report "Internet of Nano Things Market by Communication Type (Short & Long Distance Communication), by Nano Components & Devices (Cameras, Phones, Scalar Sensors, Processors, Memory Cards, Power Systems, Antennas & Transceivers) - Worldwide Forecast & Analysis (2016 - 2020), by MarketsandMarkets, defines and segments the IoNT Market into various sub-segments with in-depth analysis and forecasting of revenues. It also identifies drivers and restraints of this market with insights on trends, opportunities, and challenges. [More]
Himax Imaging to Develop Next Gen Smart Phone Cameras Using TPSCo’s 1.12um-pixel CIS 65nm Process

Himax Imaging to Develop Next Gen Smart Phone Cameras Using TPSCo’s 1.12um-pixel CIS 65nm Process

TowerJazz, the global specialty foundry leader, and TowerJazz Panasonic Semiconductor Co., Ltd. (TPSCo) today announced its first major third party CMOS image sensor (CIS) customer, Himax Imaging, Inc., a subsidiary of Himax Technologies, Inc., that is developing its next generation high end cameras for smart phone applications using TPSCo’s state of the art 1.12um-pixel CMOS image sensor (CIS) 65nm process. [More]
Altera Plans Mil Temp Qualification for 20nm Arria 10 FPGAs and SoCs

Altera Plans Mil Temp Qualification for 20nm Arria 10 FPGAs and SoCs

Altera Corporation today announced military temperature (Mil Temp) qualification plans for its newest 20 nm Arria® 10 FPGAs and SoCs, which will be qualified for extreme temperature environments (-55C to 125C ambient). In addition to the ratings, Altera can provide guidelines on speed grades, protocols, and external memory interfaces best suited to specific applications. [More]
Renesas Develops 40-nm Based RH850/C1x Series 32-bit MCUs for Electric Vehicles

Renesas Develops 40-nm Based RH850/C1x Series 32-bit MCUs for Electric Vehicles

Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced the new RH850/C1x Series of 32-bit microcontrollers (MCUs), designed for motor control in hybrid electric vehicles (HEVs) and electric vehicles (EVs). [More]
Novel Prototype Device to Test Compound Semiconductor Nanowires

Novel Prototype Device to Test Compound Semiconductor Nanowires

In the consumer electronics industry, the mantra for innovation is higher device performance/less power. Arun Thathachary, a Ph.D. student in Penn State’s Electrical Engineering Department, spends his days and sometimes nights in the cleanroom of the Materials Research Institute’s Nanofabrication Laboratory trying to make innovative transistor devices out of materials other than the standard semiconductor silicon that will allow higher performance using less power. [More]
New Class of Nanoscale Materials Made in Sheets Only Three Atoms Thick

New Class of Nanoscale Materials Made in Sheets Only Three Atoms Thick

Scientists have developed what they believe is the thinnest-possible semiconductor, a new class of nanoscale materials made in sheets only three atoms thick. [More]
Innovative Optical Amplifier Design by Combining Nanoplasmonics and Optical Microresonators

Innovative Optical Amplifier Design by Combining Nanoplasmonics and Optical Microresonators

By combining plasmonics and optical microresonators, researchers at the University of Illinois at Urbana-Champaign have created a new optical amplifier (or laser) design, paving the way for power-on-a-chip applications. [More]
Three New Products from KLA-Tencor to Support 5D Patterning Control Solution

Three New Products from KLA-Tencor to Support 5D Patterning Control Solution

Today, KLA–Tencor Corporation introduced the WaferSight™ PWG patterned wafer geometry measurement system, the LMS IPRO6 reticle pattern placement metrology system and the K–T Analyzer® 9.0 advanced data analysis system. [More]
Samsung Announces Mass Production of New 20-nm Class Process Technology-based RDIMMs

Samsung Announces Mass Production of New 20-nm Class Process Technology-based RDIMMs

Samsung Electronics, Ltd. announced today that it has started mass producing the industry’s first 64 gigabyte (GB), double data rate-4 (DDR4), registered dual Inline memory modules (RDIMMs) that use three dimensional (3D) “through silicon via” (TSV) package technology. [More]
HLMC Develops Functioning Silicon Cells Using Cypress' 55-nm SONOS Embedded Flash Memory IP

HLMC Develops Functioning Silicon Cells Using Cypress' 55-nm SONOS Embedded Flash Memory IP

Cypress Semiconductor Corp., a leading provider of embedded nonvolatile memory solutions, and Shanghai Huali Microelectronics Corporation (HLMC), one of the most advanced pure play wafer foundries in China, today announced the companies have developed functioning silicon cells using Cypress's SONOS (Silicon Oxide Nitride Oxide Silicon) embedded Flash memory intellectual property (IP) at the 55-nanometer process technology node. [More]