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Entegris Announces its CMP Filtration Solutions Using Nano-Melt-Blown Filtration Technology at SEMICON® Taiwan Tradeshow

Entegris Announces its CMP Filtration Solutions Using Nano-Melt-Blown Filtration Technology at SEMICON® Taiwan Tradeshow

Entegris, Inc., a leader in yield-enhancing materials and solutions for highly advanced manufacturing environments, announced today at the SEMICON® Taiwan tradeshow the development of a platform of CMP filtration solutions using nano-melt-blown (NMB) filtration technology, as well as the expansion of its CMP research, analytical services and manufacturing capabilities in Taiwan. These investments enable the company to further serve the growing demand for advanced CMP filtration solutions. [More]
DCG Systems® Releases OptiFIB™ Taipan Circuit Edit Solution for Advanced IC Nodes

DCG Systems® Releases OptiFIB™ Taipan Circuit Edit Solution for Advanced IC Nodes

DCG Systems® today announces the release of the OptiFIB™ Taipan circuit edit solution for the most advanced integrated circuit (IC) nodes. [More]
Georgia Tech Becomes Founding Member of Flexible Hybrid Electronics Manufacturing Innovation Institute

Georgia Tech Becomes Founding Member of Flexible Hybrid Electronics Manufacturing Innovation Institute

The Georgia Institute of Technology has become a founding member of the new Flexible Hybrid Electronics Manufacturing Innovation Institute (FHE-MII) established by the U.S. Department of Defense. [More]
Cadence to Demonstrate 10nm FinFET Process at TSMC 2015 OIP Ecosystem Forum

Cadence to Demonstrate 10nm FinFET Process at TSMC 2015 OIP Ecosystem Forum

Cadence Design Systems, Inc. today announced it will be showcasing how it leverages the TSMC Open Innovation Platform® (OIP) to optimize customer designs and manufacturing efficiency to ensure first-time product success on the 10nm FinFET (10FF) process at TSMC 2015 OIP Ecosystem Forum. The event is being held on September 17, 2015, at the Santa Clara Convention Center. [More]
Tezzaron and Novati Introduce Eight-Layer 3D IC Wafer Stack Containing Active Logic

Tezzaron and Novati Introduce Eight-Layer 3D IC Wafer Stack Containing Active Logic

Today at the IEEE 3DIC conference, Tezzaron Semiconductor and their manufacturing subsidiary, Novati Technologies, announce the world’s first eight-layer 3D IC wafer stack containing active logic. [More]
AMD Radeon R9 Nano Mini ITX Graphics Card Enables 4K Gaming in the Living Room

AMD Radeon R9 Nano Mini ITX Graphics Card Enables 4K Gaming in the Living Room

AMD continues to push the boundaries of graphics card design, today announcing its category-creating AMD Radeon™ R9 Nano, the fastest Mini ITX graphics card ever to enable 4K gaming in the living room through ultra-quiet, ultra-compact PC designs. [More]
Hot Chips Symposium: AMD to Highlight Carrizo Accelerated Processing Unit and Fiji GPUs

Hot Chips Symposium: AMD to Highlight Carrizo Accelerated Processing Unit and Fiji GPUs

Top technologists from AMD are detailing the engineering accomplishments behind the performance and energy efficiency of the new high-performance Accelerated Processing Unit (APU), codenamed "Carrizo," and the new AMD Radeon™ R9 Fury family of GPUs, codenamed "Fiji," at the prestigious annual Hot Chips symposium starting today. [More]
eSilicon Adds CSMC to Multi-Project Wafer Explorer for Instant MPW Quotes

eSilicon Adds CSMC to Multi-Project Wafer Explorer for Instant MPW Quotes

eSilicon Corporation, a leading independent semiconductor design and manufacturing solutions provider, today announced the addition of CSMC Technologies Corporation, a leading pure-play specialty analog foundry, to MPW Explorer. MPW Explorer is eSilicon's automated, instant online quote system for multi-project wafer (MPW) shuttles. [More]
Nanoscience Students Achieve Breakthrough in Self-Assembling Molecular Electronics

Nanoscience Students Achieve Breakthrough in Self-Assembling Molecular Electronics

When researchers dream about electronics of the future, they more or less dream of pouring liquids into a beaker, stirring them together and decanting a computer out onto the table. This field of research is known as self-assembling molecular electronics. But, getting chemical substances to self-assemble into electronic components is just as complicated as it sounds. Now, a group of researchers has published their breakthrough within the field. The group consists of first-year nanoscience students from the University of Copenhagen. [More]
Nanobeak Engages China Merchants Bank New York for $20 Million Private Placement

Nanobeak Engages China Merchants Bank New York for $20 Million Private Placement

Vantage mHealthcare, Inc. (“Vantage Health” or the “Company”) today announced that Nanobeak LLC, its parent company, has engaged China Merchants Bank New York for a private placement of $20 million in equity for the Company exclusively for China. [More]