Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced that the company has developed second generation 19 nanometer process technology that it will apply to mass production of 2-bit-per-cell 64 gigabit NAND memory chips later this month.
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Xilinx, Inc. today announced that its All Programmable 7 series FPGAs and Zynq®-7000 All Programmable SoCs have achieved full PCI Express® compliance and are now listed on the PCI-SIG integrator's list.
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Imagine a bendable tablet computer or an electronic newspaper that could fold to fit in a pocket. The technology for these devices may not be so far off. Northwestern University researchers have recently developed a graphene-based ink that is highly conductive and tolerant to bending, and they have used it to inkjet-print graphene patterns that could be used for extremely detailed, conductive electrodes.
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The miniaturization of electronics continues to create unprecedented capabilities in computer and communications applications, enabling handheld wireless devices with tremendous computing performance operating on battery power. This same miniaturization of electronic systems is also creating new opportunities in biotechnology and biophysics.
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SanDisk Corporation, a global leader in flash memory storage solutions, today announced it has begun customer sampling of flash memory products based on its industry-leading 1Ynm process technology, which represents its second generation 19 nanometer (nm) manufacturing technology.
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A team of University of Pennsylvania engineers has used a pattern of nanoantennas to develop a new way of turning infrared light into mechanical action, opening the door to more sensitive infrared cameras and more compact chemical-analysis techniques.
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Berkeley Design Automation, Inc., provider of the world’s fastest nanometer circuit verification, today announced the immediate availability of Analog Characterization Environment (ACE™)—a high-productivity system to ensure nanometer-scale analog and mixed-signal circuits meet rigorous design performance requirements.
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A team of scientists has won a berth on a tiny satellite to explore one of NASA's most important frontiers in climate studies: the imbalance in Earth's energy budget and the extent to which fast-changing phenomena, like clouds, contribute to that imbalance.
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Axcelis Technologies, Inc., a leading supplier of enabling ion implantation solutions for the semiconductor industry, announced today that it has received a multiple system upgrade order from a leading semiconductor manufacturer based in Asia for Axcelis' new GSD Series High Performance End Station upgrade, designed to significantly enhance system productivity and process performance.
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LAST POWER1, the European Union-sponsored program aimed at developing a cost-effective and reliable technology for power electronics, today announced its three-year program achievements that place Europe at the forefront of research and the commercialization of energy-efficient devices for industrial and automotive applications, consumer electronics, renewable-energy conversion systems, and telecommunications.
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