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Telecom Engineer Designs New Devices Based on Metamaterials

Telecom Engineer Designs New Devices Based on Metamaterials

Víctor Torres Landivar, Telecommunications engineer, has designed and manufactured new devices based on metamaterials (artificial materials with properties not found in nature). On drawing up his PhD, defended at the Public University of Navarre (UPNA), he achieved the first experimental demonstration ever with epsilon-near-zero (ENZ) metamaterials. [More]
Aehr Test Systems to Debut FOX-1P Single Wafer Test System at 2014 ITC

Aehr Test Systems to Debut FOX-1P Single Wafer Test System at 2014 ITC

Aehr Test Systems, a worldwide supplier of semiconductor test and burn-in equipment, today announced that it is introducing the FOX-1P system, its next generation single wafer test system for high volume production and early failure rate (EFR) test, at the 2014 International Test Conference (ITC) taking place October 21-23 in Seattle, Washington at the Washington State Convention Center (Booth #515). [More]
Cadence Helps GUC Complete First Production Design on TSMC’s 16nm FinFET Plus Process

Cadence Helps GUC Complete First Production Design on TSMC’s 16nm FinFET Plus Process

Cadence Design Systems, Inc., a leader in global electronic design innovation, and Global Unichip Corporation (GUC), the Flexible ASIC LeaderTM, today announced that GUC used the Cadence® Encounter® Digital Implementation System to tape out its first production high performance computation ASIC design on TSMC’s 16nm FinFET Plus (16FF+) process. [More]
Samsung Electronics Mass Produces 20nm 8Gb DDR4 DRAM

Samsung Electronics Mass Produces 20nm 8Gb DDR4 DRAM

Samsung Electronics Co., Ltd., the world leader in memory technology, today announced that it is mass producing the industry’s most advanced 8-gigabit (Gb) DDR4 memory and 32-gigabyte (GB) module, both of which will be manufactured based on a new 20-nanometer (nm) process technology, for use in enterprise servers. [More]
Synopsys Debuts DesignWare STAR Memory System for Embedded Flash Product

Synopsys Debuts DesignWare STAR Memory System for Embedded Flash Product

Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today introduced the DesignWare® STAR Memory System® for Embedded Flash product, the industry's first integrated memory test and repair solution with test algorithms optimized for on-chip embedded flash memories. [More]
IBM's Microelectronics Business to be Acquired by GLOBALFOUNDRIES

IBM's Microelectronics Business to be Acquired by GLOBALFOUNDRIES

IBM and GLOBALFOUNDRIES today announced that they have signed a Definitive Agreement under which GLOBALFOUNDRIES plans to acquire IBM's global commercial semiconductor technology business, including intellectual property, world-class technologists and technologies related to IBM Microelectronics, subject to completion of applicable regulatory reviews. GLOBALFOUNDRIES will also become IBM's exclusive server processor semiconductor technology provider for 22 nanometer (nm), 14nm and 10nm semiconductors for the next 10 years. [More]
Glasgow Nanofabrication Expert Honored with Institute of Physics President’s Medal

Glasgow Nanofabrication Expert Honored with Institute of Physics President’s Medal

Professor Douglas Paul received the Institute of Physics President’s Medal at an event in London today (Wednesday 15 October). [More]
TSMC Honors Cadence with Partner of the Year Awards for Soft IP and 16nm FinFET Plus Solutions

TSMC Honors Cadence with Partner of the Year Awards for Soft IP and 16nm FinFET Plus Solutions

Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced that it has won two TSMC Partner of the Year awards during the TSMC Open Innovation Platform® (OIP) Ecosystem Forum. Cadence was presented with awards for both Soft IP and joint development of 16nm FinFET Plus (16FF+) design infrastructure. [More]
Trillion Sensors Summit: Thinfilm to Present on Printed Electronics for Sensor Manufacturing

Trillion Sensors Summit: Thinfilm to Present on Printed Electronics for Sensor Manufacturing

Thin Film Electronics ASA (“Thinfilm”), a leader in the development and commercialization of printed electronics, today announced that its chief executive officer, Dr. Davor Sutija, will deliver a talk on the role printed electronics can play in sensor manufacturing at TSensors (Trillion Sensors) Summit San Diego. [More]
Synopsys Honored with TSMC Partner of the Year Award for Interface IP and Joint Development of 16-nm FinFET Plus Design Infrastructure

Synopsys Honored with TSMC Partner of the Year Award for Interface IP and Joint Development of 16-nm FinFET Plus Design Infrastructure

Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced that TSMC is recognizing Synopsys with their "2014 Partner of the Year" award in the areas of: Interface IP and Joint Development of 16-nm FinFET Plus Design Infrastructure. [More]