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Aehr Test Systems Announces Initial Order for FOX-15 Multi-Wafer Test and Burn-In Systems

Aehr Test Systems Announces Initial Order for FOX-15 Multi-Wafer Test and Burn-In Systems

Aehr Test Systems, a worldwide supplier of semiconductor test and burn-in equipment, today announced it has received an order from a new customer for a FOX-15 Multi-Wafer Test and Burn-In System, multiple WaferPak™ contactors and a WaferPak Aligner. [More]
Georgia Tech Institute for Electronics and Nanotechnology Supports MEMS-Related R&D

Georgia Tech Institute for Electronics and Nanotechnology Supports MEMS-Related R&D

Your smartphone likely uses a dozen or so tiny — yet powerful — MEMS sensors to support its sophisticated functions. And that late-model car undoubtedly carries scores of devices based on MEMS and other sensing technologies. [More]
International Conference on Frontiers of Characterization and Metrology for Nanoelectronics 2015 Concludes Successfully

International Conference on Frontiers of Characterization and Metrology for Nanoelectronics 2015 Concludes Successfully

The characterization technology needed for nanoelectronic materials and device research, development, and manufacturing was discussed by experts from industry, government, and academia at the 2015 International Conference on Frontiers of Characterization and Metrology for Nanoelectronics (FCMN), which was held in Dresden, Germany, on April 14-16, 2015. [More]
Synopsys Announces New Extensions to its Open-Source Interconnect Technology Format

Synopsys Announces New Extensions to its Open-Source Interconnect Technology Format

Synopsys, Inc. today announced new extensions to its open-source Interconnect Technology Format (ITF) which enable modeling of complex device and interconnect parasitic effects at the advanced 10-nanometer (nm) process node. The new extensions include modeling of variation effects due to multi-patterning technology (MPT). [More]
University of Cambridge to Acquire Veeco’s Propel GaN MOCVD System for Power Electronics

University of Cambridge to Acquire Veeco’s Propel GaN MOCVD System for Power Electronics

Veeco Instruments Inc. announced today that the University of Cambridge, one of the most highly regarded research universities in the world, has ordered the Propel™ Power Gallium Nitride (GaN) Metal Organic Chemical Vapor Deposition (MOCVD) System for GaN-on-silicon (Si) power electronics and light emitting diode (LED) research and development. [More]
Single Molecule Switches On Current Flow Using Light

Single Molecule Switches On Current Flow Using Light

Researchers from Konstanz and Dresden succeed in light-controlled molecule switching [More]
Kulicke & Soffa Joins A*STAR IME’s High-Density Fan-Out Wafer Level Packaging Consortium

Kulicke & Soffa Joins A*STAR IME’s High-Density Fan-Out Wafer Level Packaging Consortium

Kulicke and Soffa Industries, Inc. today announced they are joining A*STAR’s Institute of Microelectronics (IME)’s High-Density Fan-Out Wafer Level Packaging (FOWLP) consortium, together with other major industry players. [More]
imec Awards Ovivo Contract to Provide Ultrapure Water Plant for New  Nanoelectronics R&D Facility

imec Awards Ovivo Contract to Provide Ultrapure Water Plant for New Nanoelectronics R&D Facility

Ovivo Inc. was awarded a contract to provide state of the art Ultrapure Water (UPW) plant for the new clean room facilities of the world-leading semiconductor research institute imec in Leuven, Belgium. The system is scheduled for delivery end 2015. [More]
April 2015 Marks 50th Anniversary of Moore's Law

April 2015 Marks 50th Anniversary of Moore's Law

This month marks the 50th anniversary of Moore's Law, an observation that every couple of years, computer chip manufacturers manage to squeeze twice as many transistors onto a computer chip. Moore’s Law embodies the exponential increase in raw computing power that unleashed a blizzard of tech innovations. [More]
Cascade Microtech Introduces MPEM Module for Testing Copper Interconnects with Nanoscale Geometries

Cascade Microtech Introduces MPEM Module for Testing Copper Interconnects with Nanoscale Geometries

Cascade Microtech, Inc. is introducing a new Multipurpose Electromigration (MPEM) module featuring an intuitive, full-featured test suite for predicting the lifetime and reliability of copper interconnects in modern integrated circuits. Cascade Microtech's new MPEM module offers researchers a broadly capable tool with multiple electromigration (EM) test applications in one convenient, low-cost, high-performance system. [More]