Mar 3 2009
Lam Research Corporation (NASDAQ:LRCX), a major supplier of semiconductor wafer fabrication equipment and services, today announced selection of its TCP 9400DSiE deep silicon etch system by Robert Bosch GmbH. Bosch is the world's leading MEMS (micro-electromechanical systems) sensor manufacturer, specializing in automotive sensors and consumer devices.
“The Bosch name is synonymous in the industry with deep silicon etch technology, so we are extremely pleased our TCP 9400DSiE etch system has been qualified by Bosch,” said Marshall Benham, MEMS product line head at Lam Research. “This decision signals the need for production-proven solutions in growing MEMS segments that are transitioning to volume manufacturing. These customers expect the highest degree of technology embedded on manufacturing-worthy platforms.”
The TCP 9400DSiE system is based on Lam’s production-proven TCP 9400 silicon etch series with more than 1,500 chambers installed worldwide. The system’s patented high-density TCP plasma source provides an ideal configuration to meet the challenges of silicon deep reactive ion etch, offering broad process capability and flexibility for a wide range of MEMS, advanced packaging, and power semiconductor applications. Optimized source and chamber hardware deliver excellent profile control, cross-wafer symmetry, and repeatability, which are important for ensuring high yield in MEMS devices. Incorporation of Lam’s proprietary in situ chamber cleaning technology enables excellent etch rate stability and high uptime. These proven capabilities help MEMS manufacturers ramp new applications quickly to high-volume production.
Statements made in this press release which are not statements of historical fact are forward-looking statements and are subject to the safe harbor provisions created by the Private Securities Litigation Reform Act of 1995. Such forward-looking statements relate, but are not limited, to customer plans and expectations, process results from Lam’s tool, such as the applications for which it is suited, profile control, cross-wafer symmetry and repeatability, yield, etch rate stability, uptime and the ability of users to ramp new applications quickly to high-volume production. Important factors that might affect these forward-looking statements include the processes used on the Lam tool, how it is operated and maintained, and changing business conditions that affect customer plans and expectations. These forward-looking statements are based on current expectations and are subject to uncertainties and changes in condition, significance, value and effect as well as other risks detailed in documents filed with the Securities and Exchange Commission, including specifically the report on Form 10-K for the year ended June 29, 2008, and Form 10-Q for the quarter ended December 28, 2008, which could cause actual results to vary from expectations. The Company undertakes no obligation to update the information or statements made in this press release.