Tegal Corporation, (Nasdaq:TGAL)
an innovator of specialized production solutions for the fabrication of advanced
MEMS, power ICs and optoelectronic devices, today announced it has received
an order for a Tegal 110 S/DE DRIE tool from a leading provider of advanced
systems and technologies products. The Tegal 110 S/DE DRIE tool will ship in
the current quarter, and will be used by the customer for multiple silicon DRIE
and dielectric film DRIE applications.
The DRIE tool order from this first-time Tegal DRIE customer was secured by
Tegal following a thorough, multi-vendor competitive evaluation by the customer,
which included an inspection visit to Tegal’s Petaluma, CA, DRIE process
demonstration laboratory. The Tegal 110 S/DE, with its superior DRIE process
results, wide-ranging DRIE process flexibility, robust and user-friendly industrial
design, combined with Tegal’s long-standing reputation for award-winning
post-sales customer support, represented the best overall value of all the DRIE
tools evaluated by the customer, resulting in the present order.
The Tegal 110 S/DE system is a high-density plasma etch tool featuring an inductively
coupled plasma etch reactor and magnetic plasma confinement. The tool can run
Tegal’s patented SHARP – Super High Aspect Ratio Process, achieving
etched feature aspect ratios of >100:1 in production environments. Together
with its high reliability, broad process windows, and high etch rates, the Tegal
110 S/DE system is a critical enabler for etching silicon (S) and dielectric
(DE) films found in the MEMS/MOEMS, bio-tech, and hi-voltage markets. Tegal
DRIE tools are presently employed in numerous research and development laboratories
throughout the world, engaging in both commercial and academic research programs,
and are also found in MEMS foundries and other dedicated commercial High Volume
Manufacturing lines world-wide.
Posted October 22nd, 2009
