Inc. (NASDAQ: RTEC) and SEMATECH, the global consortium of leading chipmakers,
announced today that Rudolph has joined SEMATECH's 3D Interconnect Program at
the College of Nanoscale Science and Engineering (CNSE) of the University at
Albany. The joint partnership is a continuation of collaborative efforts in
process characterization, with a new focus on 3D IC (three-dimensional integrated
circuits) processing and enhancing process control of TSV (through-silicon vias)
manufacturing. This is the second year that Rudolph will serve as a Member of
As a member of SEMATECH's 3D program, Rudolph's inspection and metrology technologies
will be applied to various projects including via depth and CD metrology, metallization
void detection, stacked wafer via alignment, wafer edge defect detection and
bump height coplanarity.
"The advanced device design and complex manufacturing requirements of
3D packaging opens a new frontier of process control challenges. Rudolph is
well positioned, both with existing and emerging technologies, to be the semiconductor
industry's premier TSV process control solution provider," stated Ardy
Johnson, Rudolph's vice president of marketing.
Sitaram Arkalgud, director of 3D interconnect at SEMATECH added, "We are
pleased to welcome Rudolph as a partner. Rudolph's proven expertise in defect
detection, characterization, and data analysis will be significant in developing
technologies and processes that will continue to drive implementation of manufacturable
and cost-effective 3D TSV processes."
Richard Brilla, vice president for strategy, alliances and consortia at CNSE,
said, "The addition of Rudolph Technologies' innovative metrology and characterization
capabilities will further enhance the leading-edge research being conducted
as part of SEMATECH's 3D Interconnect Program at CNSE's Albany NanoTech. At
the same time, it will build on the world-class research and development at
the UAlbany NanoCollege, which is providing critical solutions for the world's
leading companies in the highly competitive global nanoelectronics industry."