Building on its established reputation for market leading etch hardware, the
team at Oxford
Instruments Plasma Technology (OIPT) has developed an evolution of its System
133 RIE-ICP380 tool.
The new technology is an active spacer that improves the uniformity of the
plasma across the electrode, giving excellent etch results both within wafer and
cross batch. A key benefit is that it allows an increase in batch size from 20 x
2¡± GaN wafers to 27 x 2¡±, or a mammoth 7 x 4¡± GaN and 18 x 2¡± Sapphire
Dr Mark Dineen, Principal Applications Engineer says ¡°OIPT¡¯s new spacer
offers uniformity tuning at will, which simplifies the process. This allows
enhanced process performance and higher throughput, which is essential for our
The spacer is retrofittable to its systems in the field.
OIPT¡¯s well proven System 133 Process Module is built on a 300mm platform,
with multibatch capability, and with processes guaranteed to ensure rapid start
up during installation. It may be clustered to combine technologies and
processes, offering maximum flexibility. With an installed base of over 2000
tools worldwide, OIPT tools boast over 90% uptime.