"Achieving 64Mb SRAM yield across all three 28nm process nodes is striking.
It is particularly noteworthy because this achievement demonstrates the manufacturing
benefits of the gate-last approach that we developed for the two TSMC 28nm high-k
metal gate processes," explained Dr. Jack Sun, vice president, Research
and Development at TSMC.
"This accomplishment underscores TSMC's process technology capability
and value in 28nm. It shows TSMC is not only able to extend conventional SiON
technology to 28nm, but is also able to deliver the right 28nm HKMG technology
at the same time," explained Dr. Mark Liu, senior vice president, Advanced
Technology Business at TSMC.
The TSMC 28nm development and ramp-up has remained on track since the announcement
made in September of 2008. The 28LP process is expected to enter risk production
at the end of Q1 of 2010, followed closely by the 28HP risk production at the
end of Q2 and the 28HPL risk production in Q3.
The 28nm LP process will serve as a fast time-to-market and low cost technology
ideal for cellular and mobile applications. The 28nm HP process is expected
to support devices such as CPUs, GPUs, Chipsets, FPGAs, networking, video game
consoles, and mobile computing applications that are performance demanding.
The 28nm HPL process features low power, low leakage, and medium-high performance.
It is aimed to support applications such as cell phone, smart netbook, wireless
communication and portable consumer electronics that demand low leakage.
All 28nm TSMC processes feature a comprehensive design infrastructure based
on the company's Open Innovation Platform to extend the power of
the technology to a broad range of differentiating products.
TSMC is the world's largest dedicated semiconductor foundry, providing
the industry's leading process technology and the foundry's largest
portfolio of process-proven libraries, IP, design tools and reference flows.
The Company's total managed capacity in 2008 exceeded 9 million 8-inch
equivalent wafers, including capacity from two advanced 12-inch - GigaFabs,
four eight-inch fabs, one six-inch fab, as well as TSMC's wholly owned
subsidiaries, WaferTech and TSMC (China), and its joint venture fab, SSMC. TSMC
is the first foundry to provide 40nm production capabilities. Its corporate
headquarters are in Hsinchu, Taiwan.