UMC (NYSE: UMC; TSE: 2303),
a leading global semiconductor foundry, today announced that it has completed
the foundry industry's first reported carbon footprint verification for integrated
circuit wafers produced at its facilities. UMC conducted carbon footprint inventory
on its 200mm wafers at the company's Fab 8A according to international carbon
footprint standard PAS2050, with the results receiving third party verification
by Det Norske Veritas (DNV). UMC is the only semiconductor company in Taiwan
that independently calculates, verifies, and reports carbon footprints for its
products.
Mr. Muh Liang Liao, vice president from UMC, said, "UMC has always paid
special attention to the issue of climate change and has aggressively implemented
comprehensive carbon management programs. Due to the advanced technologies and
numerous materials involved in the manufacturing of semiconductor wafers, carbon
footprint calculation is quite complicated. Since UMC started its product life
cycle assessment in all fabs in 2005, we were able to complete this verification
in the shortest time possible. The result is a significant milestone for UMC's
development in green production. This verification provides complete, scientific
and reliable disclosure on the carbon information of products manufactured in
our fabs as well as self-review on environmental impact. Moreover, it is a demonstration
of UMC's social responsibility to practice transparent communication with our
stakeholders."
UMC's comprehensive carbon management program includes energy-saving and carbon
reduction measures with priority on reducing carbon in the manufacturing processes.
UMC led the foundry industry to complete the replacement of C2F6 with lower
GWP C3F8 in 2007. This replacement program helped reduce CO2 emissions by 410,000
metric tons in 2008, a reduction of around 25% of UMC's total CO2 emissions.
Furthermore, UMC's introduction of C4F8 in 2008 further enhanced UMC's carbon
reduction with more efficient CO2 reduction. UMC also believes in the importance
of timely disclosure of carbon information and ensuring data quality. Since
2006, UMC has participated in the Carbon Disclosure Project (CDP) formed by
global institutional investors, disclosing UMC's annual greenhouse gas emission
volume, reduction goals and results. Moreover, UMC adopts third-party verifiers
to ensure the quality of data. UMC completed verification on greenhouse gas
emissions and reduction from 2000 to 2008 for all of our Taiwan fabs, with efforts
ongoing every year.
Carbon footprint verification serves as the basis for UMC to further promote
green products, green manufacturing processes and green design. Going forward,
UMC is committed to advance carbon management in a more practical way and to
fulfill the responsibility as a corporate citizen by reducing CO2 more aggressively.
UMC (NYSE: UMC, TSE: 2303) is a leading global semiconductor foundry that
provides advanced technology and manufacturing services for applications spanning
every major sector of the IC industry. UMC's customer-driven foundry solutions
allow chip designers to leverage the strength of the company's leading-edge
processes, which include production proven 65nm, 45/40nm, mixed signal/RFCMOS,
and a wide range of specialty technologies. Production is supported through
10 wafer manufacturing facilities that include two advanced 300mm fabs; Fab
12A in Taiwan and Singapore-based Fab 12i are both in volume production for
a variety of customer products. The company employs approximately 12,000 people
worldwide and has offices in Taiwan, Japan, Singapore, Europe, and the United
States.