Sep 24 2009
Jordan Valley Semiconductors Ltd., the market leader in X-ray metrology tools is pleased to announce the delivery of its JVX6200 XRR (X-Ray Reflectometry) metrology tool to a leading-edge HDD (Hard Disk Drive) vendor, used for quality control of its HDD head manufacturing process.
A key advantage of the XRR metrology is its capability to simultaneously measure production stacks of >15 layers of mixed opaque and/or transparent nano layers films and report the thickness, density and roughness of each individual layer.
"One of the challenges facing the leading edge HDD manufacturers is to control the complex, ultra thin multilayer deposition process in a timely, economic way," commented Isaac Mazor, President and CEO of Jordan Valley Semiconductors.
"Our customer selected the JVX6200 system after extensive evaluations of the tool capabilities and comparison to other methods, and based on its outstanding ROI (Return On Investment), ease of use and the robustness of the XRR technology," added Mr. Mazor.
Jordan Valley's XRR technology is fast, production worthy and non-destructive and has proven to be an excellent replacement for extremely expensive destructive testing.
"The unique power of resolving a stack of >15 layers without prior calibration or knowledge of materials properties make the XRR extremely valuable and useful for early process degradation detection and save time and money to our customers," added Mr. Mazor.
About the JVX6200 X-ray metrology tool
Jordan Valley's JVX6200 X-ray metrology tool is a multi channel, high throughput and small footprint, fully automated metrology tool, in use at many advanced production fabs worldwide. The JVX6200 is used for advanced process control at the front end of line (FEOL) and back-end of line (BEOL), WLP (Wafer level packaging), MRAM and other new applications in fabs worldwide. The JVX6200 X-Ray Reflectometry (XRR) is a non-contact, non-destructive, surface-sensitive technique that delivers precise and accurate characterization of thin films and multi-layer stacks. The XRR technique measures layer thickness, density and roughness by analyzing the interference patterns of X-rays reflecting off the layers surfaces and interfaces. The JVX6200 XRR analyzes single and multiple thin films metal and dielectric layers from 1nm to 1um thick. Jordan Valley's advanced XRR technology allows measurements on production wafers and offers superior throughput.