Markets, the leading source for international market research and market
data, has announced the addition of the "MEMS
equipment and materials market" report to their offering.
Discover key trends in MEMS manufacturing processes and materials. Despite
the crisis, innovation is still driving the MEMS business
The MEMS business continues to be driven by innovation. Following the demand
for MEMS devices for cell phones, the MEMS customer wants to have smaller, higher
performance and less costly MEMS dies. For the toolmakers, it means a continuous
development effort for new processes for quicker deep etch rate, cleaner sacrificial
etching, new metallic bonding, 3D packaging approaches and wafer level testing
to name a few. The new "World MEMS Equipment & Materials Market 2009"
("WMEM 09") describes the trends and opportunities for equipment and
materials for MEMS production. This report gives market forecasts for MEMS devices
and the associated MEMS equipment and materials. Although the MEMS sector will
remain flat overall for the next year or so, there are growth sectors and room
for innovation for inertial MEMS (for cell phones), RF switches, energy harvesting
The MEMS production tool market will be flat for 2009/2010, but MEMS equipment
R&D is still active as players prepare for a ramp up in 2011. By 2012, the
MEMS equipment market will reach $500M.
The WMEM 09 report provides in-depth analysis for the different types of tools
for MEMS production:
- Deep Etching
- Sacrificial Etching
- Deposition & Cleaning
- MEMS on IC
- Through Si Vias
- Testing CAD Tools
Main report highlights
For each type of equipment the report provides information about the market
and technology trends. For example, there are currently many competing sacrificial
release technologies, but we see a growing interest for XeF2 sacrificial etching.
This is a very particular technology as it cannot be used for SiO2 but for
Si, SiGe, polySi, W, Ti and Mo. Although it was restricted to some niche applications
with only one large volume production (iMoDTM from QMT), it seems there is an
increased interest for this technology. Another specific MEMS process, bonding,
is moving away from glass and anodic to more metal based, for better hermeticity
and thinner line widths, but the bulk is still the traditional processes, and
the push there of course is to reduce the amount of silicon real estate taken
up by the glass frit to get more devices on a wafer without giving up performance.
Although, technically speaking, there are no MEMS that require only stepper
lithography for all layers in the stack, the motivations currently causing a
shift from aligners to stepper lithography for MEMS are manufacturability issues
and infrastructure evolution issues.
Something new is the possible coming for Standard processes for MEMS. For a
long time, the MEMS production rule has been "One product, one process,
one package!" But European foundries and R&D institutes argue standard
process modules are possible for MEMS production. Silex is leading the way,
inspired by its through-wafer via and WLP platform: the more a fabs' customer
can use identical process blocks, modules or platforms, the better the process
control and yield and the lower the costs. Other players are CEA-Léti
for standard processes on 8-inch wafers for R&D fabs. Examples of modules
include TSV , WL packaging, hermetic bonding or Si membrane. Integrating different
modules together creates a function (sensor, actuator .). This approach is competing
with use of CMOS process for MEMS structures.
Packaging is key for new MEMS design. For example, 3D integration with TSV
is now an industrial reality with continuous growth expected. 3D Integration
with TSV for MEMS is likely to be the next relay of growth for DRIE market and
3D TSV is pushing the need for quicker etch rate (towards the 100µ/min!).
DRIE is currently used mostly for inertial MEMS manufacturing and is also increasingly
used in replacement of wet for microphones, pressure sensors (because of better
control of feature profile, depth and uniformity across the wafer). Current
challenges for DRIE are the removal of polymer after Bosch process, sidewall
roughness, end-point detection, reproducibility & reliability and increased
Materials for MEMS will be a $470M market in 2012. In terms of wafer size,
there is a transition from 6'' to 8'' wafer size for the companies involved
in high volume MEMS applications. There are 10 MEMS companies already processing
8" wafers with 5 new announcements in 2009. SOI wafers are used and represent
about 23% of total processed wafer in $M value. Thick SOI (0.2 to 60 µ)
is used for sacrificial release. There is a trend for thicker BOX (> 5 µ)
for MEMS devices requiring higher deflection (such as micromirrors or some gyros).
Yole's research draws on the ongoing work of its analysts tracking 150 MEMS
applications, aggregated into 12 major categories of devices: inkjet heads,
pressure sensors, microphones, accelerometers, gyroscopes, MOEMS, micro bolometers,
micro displays, micro fluidics, RF MEMS, micro tips, and emerging MEMS devices.
Information is gathered directly from system & device makers, and equipment
& materials suppliers.