SpringSoft, Inc. (TAIEX:2473), a global supplier of specialized IC design software, today announced support for the 40-nanometer (nm) interoperable process design kit (iPDK) introduced by TSMC.
This builds on SpringSoft’s support of the industry’s first iPDK developed by TSMC for its 65-nanometer (nm) RF process technology. Both the 40nm and 65nm TSMC iPDKs will be available for production use with the Laker™ Custom Layout Automation System by the end of the second quarter 2010.
The collaboration between the two companies is driven by their mutual support of interoperable PDKs to provide custom chip designers with manufacturing flexibility, technology choice, and design productivity. SpringSoft is a founding member of the Interoperable PDK Library Alliance (IPL) and validation partner for the TSMC 65nm iPDK.
“We are working with a broad spectrum of leading vendors like SpringSoft to ensure that the iPDK achieves the vision of open and interoperable PDKs. In this way, TSMC can support every customer's optimal design flow by enabling them to use best-in-class tools throughout the design process," commented Tom Quan, deputy director of design methodology and service marketing at TSMC.
“Our support of the TSMC 65nm iPDK and now the 40nm iPDK is a testament to our ongoing efforts to provide the most complete, open and interoperable design solutions,” said Duncan McDonald, director of custom IC product marketing for SpringSoft. “Our joint effort with the IPL to produce an interoperable standard for PDKs gives custom design engineers the flexibility and productivity they need to achieve better results faster.”