By Cameron Chai
Cambridge NanoTech has declared the supply of its 40th Fiji Plasma Atomic Layer Deposition (ALD) system. ALD is used in technologies such as lighting and display, energy storage, and microelectronics.
Cambridge NanoTech is aiming to improve ALD industrialization and research. In 2009, the company manufactured the Fiji system for providing exceptional flexibility and easy usage in experimental processes. Plasma ALD tool is apt for scientists and researchers engaged in producing ultra-thin coatings that are digitally controlled, pin-hole free, dense, and highly accurate.
The company’s plasma ALD system is suitable for processing several nitrides, oxides, metals like platinum, titanium nitride, and other materials. Obtained plasma recipes offer considerably decreased temperatures for platinum deposition and less resistivity of titanium nitride.
According to Laurent Francis, Microsystems chairman for UCL, in order to conduct research at the Université catholique de Louvain (UCL) they were seeking for high-k conformal thin films deposited at room temperature. Cambridge NanoTech had come forward with a well developed tool enabling a vast range of material selection to enhance the research work. Cambridge NanoTech rendered support to install Fiji F200 tool and ALD technique at UCL.
The Fiji ALD system enables researchers to deposit materials at varying conditions such as high and low temperatures, suggested Jill S. Becker, president and founder of Cambridge NanoTech. The system provides some additional features such as a cluster module for automation integration, a high temperature module for testing samples up to 800°C, and a wafer plus module for large-sized samples, he added.