A manufacturer and provider of thin film devices and coatings, 4Wave has declared at the close of its second quarter 2011 that it has received a number of orders from failure analysis laboratories and semiconductor manufacturers, for ion beam de-layering solutions.
With the help of 4Wave's de-layering solution, the materials can be removed atomically from a semiconductor die. The user can choose the position in the multi-layer microelectronic device where material needs to be removed for reverse engineering or failure analysis.
The ion beam de-layering technique is applicable for microelectronic equipments with a line width below 48 nm. It is possible to remove complete die layers using the de-layering equipment irrespective of its material composition exposing the circuit present below.
The company offers ion-beam thin film processing devices that are utilized for several applications and industries such as reusable energy, and defense applications. Their wide range of metrology and thin film processing devices are suitable for contracted research and coating services. This enables its customers to manufacture their own products without much expenditure in purchasing such devices. Since 4Wave devices fully comply with International Trade and Arms Regulation (ITAR), U.S. defense connected projects are supported by the company. With regular investment in production processes, 4Wave is able to showcase its device capacity to its customers and succeed in delivering production enhancing systems.
Source: http://www.4waveinc.com/