New Partnership to Develop Efficient and Eco-Friendly Cleaning Solutions for Microelectronics

Fraunhofer Center Nanoelectronic Technologies (CNT) in Dresden has inked a two-year partnership deal with bubbles & beyond, a technology firm specializing in tailored intelligent fluids, to create novel cleaning solutions for use in the microelectronics industry.

As per the deal, Fraunhofer CNT and bubbles & beyond will develop innovative decoating products for applications in the semiconductor industry. The objective of the partnership is to offer cost-effective, high-efficient, eco-friendly replacements to existing surface treatments, which are mainly based on aggressive chemicals.

bubbles & beyond’s in-house phase fluid technology (intelligent fluids) is the basis of the innovative cleaning method. The fluid technology is already being utilized in other microelectronic applications. Fraunhofer CNT provides the essential semiconductor expertise, respective research knowledge and complete and highly accurate measurement analysis to the work.

The partnership emphasizes the evaluation and improvement of the effectiveness of tailored cleaning solutions. It will also analyze semiconductor-specific criteria such as contamination risks, process stability and critical materials. Based on the results, the new technology will be evaluated for its suitability for the elimination of lithographic laquers. Then, the evaluation will be extended to other process steps.

According to bubbles & beyond’s Managing Director, Christian Roemlein, the partnership with Fraunhofer CNT will be helpful in extending the company’s reach in the microelectronics industry. Since the need for rapid, effective and environmentally friendly surface treatments of semiconductors is highly important, major companies have already shown their interest right at the early phase of partnership.

Fraunhofer CNT’s Project Manager, Matthias Rudolph commented that the organization is pleased to partner with bubbles & beyond and anticipates more novel solutions for different challenges.

Source: http://www.cnt.fraunhofer.de/

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