Sep 17 2008
Semilab Co. Ltd., a leading supplier of non-contact wafer mapping metrology solutions for the semiconductor and solar cell industries, announced today that it has licensed key patents and transferred relevant know-how from Applied Materials, Inc. The acquired intellectual property (IP) covers technology and systems used in semiconductor applications for measuring implant and metal thickness.
“We are excited to expand our line of advanced metrology solutions for characterizing semiconductor material and processes,” said Tibor Pavelka, CEO of Semilab. “This technology provides critical in-line parametric measurement capability on product wafers, covering implant junction depth and dose monitoring, and metal thickness, via and interconnect resistance measurements.”
Implant metrology systems are immediately available for shipment to Semilab’s customers.
“This agreement is a winning strategy for Semilab, enabling the company to cost-effectively leverage innovative technology to its best advantage,” said Chris Talbot, senior director of Applied’s Strategic Licensing unit.
Terms of the agreement were not disclosed.