Oct 28 2008
Palomar Technologies, provider of precision automation equipment and contract assembly services for microelectronics, will feature methods, equipment, and services for high reliability, complex packaging of hybrid and microelectronic devices and modules at IMAPS 2008. IMAPS, the 41st International Symposium on Microelectronics, will be held November 4-6, 2008 at the Rhode Island Convention Center in Providence, Rhode Island. Palomar Technologies will be exhibiting in booth #322.
Palomar Microelectronics, a fast growing segment of the company created by the demand for quick-turn product development, prototyping, test, and assembly services, operates from Palomar’s headquarters in Carlsbad, California. It provides a number of cutting-edge technologies unique to the industry, including gang pulse heat eutectic processes, stacked die with very long low loop wire bond interconnects, stitch-stitch chain bonding, and ribbon bonding. Other processes are advanced wire bonding, gold ball bumping, and precision component placement for hybrids, multichip modules, semiconductor packages, high power LEDs, MEMS devices, microwave and RF components, and optoelectronic packages. Services include assisting with designs for manufacturability and material sourcing. Processes are developed by Palomar’s design, applications, and process engineers, validated on Palomar’s automated precision microelectronic assembly equipment, refined, optimized, and then manufactured at Palomar or transferred to an EMS or the OEM.
“Palomar’s expertise in designing and manufacturing large platform, precision automation equipment for the microelectronics industry enables Palomar to offer unique capabilities to OEMS who want to design and prototype their products on the same equipment that will be used for volume manufacturing,” said Bradley Benton, Palomar’s national sales manager. “Our applications engineers have been working with OEMs to optimize their processes for over 25 years.”