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Results 51 - 60 of 3097 for Wafers
  • Dicing Sapphire Wafers
    Article - 25 Apr 2018
    Cleaving is a fast and simple method used for preparing samples of semiconductor materials, including silicon. In contrast, sapphire does not cleave well, despite being a single crystal.
  • Reportlinker Catalogue Adds Report on Permanent Wafer Bonding
    News - 31 May 2011
    Reportlinker has added a new market research report on Permanent Wafer Bonding to its catalogue. The Yole 2011 report on Technologies and Market Trends for Permanent Bonding would be a major enabler...
  • Intel To Increase 90nm Chip Production - News
    Article - 29 Oct 2003
    Intel's 90 nanometer technology is currently being moved to high volume for its Pentium and Centrino CPUs. Posted October 28 2003
  • Research and Markets Report Describes Trends on Wafer Thinning and Dicing
    News - 2 Jul 2011
    Research and Markets has added the report, "Thin Wafer Manufacturing Equipment & Materials Markets" to its offering. The report explains why thin wafers need extraordinary technologies...
  • Worldwide Analysis on Solar Wafer Industry
    News - 17 Jun 2010
    ReportsandReports Announce it Will Carry 2010 Deep Research Report on Global and China Solar Wafer or Ingot Industry Market Research Report in its Store. 2010 Deep Research Report on Global and...
  • CHAD to Demonstrate Thin Wafer Handling Capabilities at SEMICON West
    News - 18 Jun 2009
    CHAD Industries, a pioneer in the area of wafer and substrate handling for WLP (Wafer Level Packaging) applications, has announced that it will be demonstrating CHAD's thin wafer handling...
  • alpha300 Semiconductor Edition – Raman imaging microscope for large wafer inspection
    Equipment
    This product profile describes the features and applications of the alpha300 Semiconductor Edition Raman microscope for chemical imaging.
  • Nemotek Technologie
    Supplier Profile
    Nemotek Technologie manufactures customized Wafer-Level Cameras for portable applications.It provides customers with design and manufacturing services for Wafer-Level Packaging (WLP), Wafer-Level...
  • 3M and SUSS MicroTec Signs Agreement
    News - 22 Jun 2009
    3M, a leading supplier of advanced materials to the semiconductor industry, and SUSS MicroTec, a leading supplier of semiconductor processing equipment, today announced an agreement to expand access...
  • Zygo Corporation
    Supplier Profile
    Zygo is a global leader in the design and manufacture of advanced metrology systems and ultra-precise optical components and assemblies. Our mission is to enable customer success by delivering...

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