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  • SST International MODEL 3180/3190 Wafer Bonders
    Equipment
    The 3180 and 3190 are programmable wafer bonders offered by SST International for high-reliability bonding of silicon, gallium-arsenide and glass wafers up to 6 inches (150 mm) in diameter.
  • Nano Indenter - G200
    Equipment
    The KLA Nano Indenter G200 is the world’s most accurate, flexible, and user-friendly instrument for nanoscale mechanical testing.
  • Benchtop DMA Density Meters
    Equipment
    Anton Paar’s unique pulsed excitation method allows their benchtop DMA density meters to provide unparalleled reliability, accuracy and sensitivity.
  • TMC’s STACIS® III Piezoelectric Active Vibration Cancellation System
    Equipment
    TMC offers a highly sophisticated active vibration cancellation system called STACIS® III, which performs vibration cancellation in real time through continuous measurement of floor activity and...

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