Posted in | Wafer Bonders

SST International MODEL 3180/3190 Wafer Bonders

The 3180 and 3190 are programmable wafer bonders offered by SST International for high-reliability bonding of silicon, gallium-arsenide and glass wafers up to 6 inches (150 mm) in diameter.

Both systems provide precise automatic control of heating and cooling at temperatures up to 500 °C (1000°C optional). Bellows actuated clamping platens present uniform mechanical bonding pressures up to 750 pounds (350 kg) to the wafer pair. The 3190 also provides anodic (electrostatic) bonding capabilities with a user-selected high-voltage power supply and chamber feed-through. Vacuum levels down to 50 millitorr are provided in the 3180 by a two-stage mechanical pump. Vacuum levels below 1 x 10-6 torr are provided in the 3190 by a cryogenic vacuum pumping system combined with a dry mechanical forepump. Digital vacuum level gauging is provided to monitor and control vacuum levels. Machine control is provided by an embedded control system operating in a Microsoft Windows® environment. An unlimited number of process profiles can easily be created and stored in the controller. Run data is archived for quality control and off-line data analysis. Internet and intranet network connectivity is available as an option, permitting remote monitoring, troubleshooting and maintenance capabilities.


  • Silicon to Glass Wafer Bonding
  • MEMS Wafer Bonding
  • Pressure Sensor Bonding
  • Anodic Wafer Bonding

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