News - 9 Oct 2008
Building on the successful partnership on their joint process technology development since 1998, Panasonic Corporation and Renesas Technology Corp. are now collaborating on the development of...
News - 12 Sep 2008
An unusual molecule once thought to be too strained to exist has been transformed into another contorted compound by RIKEN chemists, testing the limits of how far carbon-based molecules can be...
Article - 21 Jul 2006
A number of aerospace companies have ongoing programs for the utilization of nano-sized particles of hafnium or aluminum for rocket propulsion applications.
News - 16 Jun 2020
Mixing and matching computational models of 2D materials led scientists at Rice University to the realization that excitons -- quasiparticles that exist when electrons and holes briefly bind -- can be...
News - 18 Jul 2017
A team of researchers at the University of Connecticut have discovered that decreasing oxygen in certain nanocrystalline materials may enhance their durability and strength at high temperatures, a...
News - 29 Oct 2012
IBM scientists have demonstrated a new approach to carbon nanotechnology that opens up the path for commercial fabrication of dramatically smaller, faster and more powerful computer chips.
News - 9 Jun 2009
Nanoparticle films are no longer a delicate matter: Vanderbilt physicists have found a way to make them strong enough so they don't disintegrate at the slightest touch.
In the last 25...
News - 16 Sep 2008
Intel Corporation has extended its lead in the high-end server segment, setting new standards in virtualization performance with the launch of seven 45 nanometer (nm)-manufactured Intel® Xeon®...
News - 9 Jan 2008
Over the last four decades, computer chips have found their way into virtually every electronic device in the world. During that time they have become smaller, cheaper and more powerful, but, for a...
News - 18 Dec 2008
AMD, IBM and its Fishkill Alliance partners, Intel, an NEC-Toshiba collaborative effort and TSMC all presented leading-edge logic processes at 45, 32 and 22 nm design rules at the International...