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A*STAR’s Flexure-Based Electromagnetic Linear Actuator Wins Prestigious R&D Award

A*STAR’s Flexure-Based Electromagnetic Linear Actuator Wins Prestigious R&D Award

A Flexure-Based Electromagnetic Linear Actuator (FELA) developed by the Singapore Institute of Manufacturing Technology (SIMTech), a research institute of the Agency for Science, Technology and Research (A*STAR), is the only locally-developed innovation featured in the 2014 R&D 100 Awards, an international competition that recognises the 100 most technologically-significant products introduced into the marketplace over the past year. [More]
Mapper Lithography Selects SPTS’ Etch and PECVD Systems for New Fab in Moscow

Mapper Lithography Selects SPTS’ Etch and PECVD Systems for New Fab in Moscow

SPTS Technologies, an Orbotech company and a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced that Mapper Lithography has selected SPTS’ etch and low temperature chemical vapor deposition (CVD) systems on a Versalis fxP multi-technology platform for their new fab in Moscow. [More]
New Superfast 4G High-Volume, In-Line, 3D Topography Inspection System from Ultratech

New Superfast 4G High-Volume, In-Line, 3D Topography Inspection System from Ultratech

Ultratech, Inc., a leading supplier of lithography, laser-processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs), today introduced the Superfast 4G high-volume, in-line, 3D topography inspection system. [More]
SMIC Signs Volume Purchase Agreement with ASML for Lithography Systems

SMIC Signs Volume Purchase Agreement with ASML for Lithography Systems

Semiconductor Manufacturing International Corporation the largest and most advanced pure-play foundry provider in China, and ASML Holding N.V., the world's leading provider of lithography systems, announce the signing of a volume purchase agreement (VPA) that will provide SMIC with lithography systems from ASML. [More]
Adlyte Reaches Key Performance Benchmark for EUV Light Source for High-Volume Manufacturing

Adlyte Reaches Key Performance Benchmark for EUV Light Source for High-Volume Manufacturing

Adlyte Inc., a developer of high-brightness extreme light sources for advanced semiconductor inspection and metrology applications, today announced it has reached a key performance benchmark for its extreme ultraviolet (EUV) light source for high-volume manufacturing (HVM)-readiness. [More]
Gigaphoton Reaches Milestone in Continuous Operation of Prototype LPP EUV Light Source

Gigaphoton Reaches Milestone in Continuous Operation of Prototype LPP EUV Light Source

Gigaphoton Inc., a major lithography light source manufacturer, announced today that it has succeeded in achieving 3-hour continuous operation of its prototype LPP EUV light source at 50% duty cycle and 42-W output, equivalent to usage in a high-volume-manufacturing (HVM) environment. [More]
New Report on Lithography, Deposition, and Etch Market Analysis for Flip Chip/WLP Manufacturing

New Report on Lithography, Deposition, and Etch Market Analysis for Flip Chip/WLP Manufacturing

Flip chips are appearing in a plethora of high-volume consumer products such as mobile phones, digital cameras, MP3 players, and computer peripherals. Wafer-level packaging (WLP), the fabrication of the package directly on the wafer, is experiencing exceptional growth and stands out as one of the bright growth areas in electronics today. [More]
Nano-Lithography Enables Precise ‘Writing’ and ‘Positioning’ of Lipid Membrane Fragments

Nano-Lithography Enables Precise ‘Writing’ and ‘Positioning’ of Lipid Membrane Fragments

Scientists from the University of Leeds have taken a crucial step forward in bio-nanotechnology, a field that uses biology to develop new tools for science, technology and medicine. [More]
New Automated High-Vacuum Wafer Bonding System from EV Group

New Automated High-Vacuum Wafer Bonding System from EV Group

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG®580 ComBond®¯a high-vacuum wafer bonding system, which enables electrically conductive and oxide-free covalent bonds at room temperature. [More]
CiS Research Institute Places Order for USHIO’s Large-Area, Full-Field Projection Lithography System

CiS Research Institute Places Order for USHIO’s Large-Area, Full-Field Projection Lithography System

USHIO INC. today announced that the company has received an order for its UX4 large-area, full-field projection lithography from a German research institute, CiS Forschungsinstitut für Mikrosensorik und Photovoltaik GmbH (hereafter CiS), through its wholly owned subsidiary USHIO EUROPE B.V. [More]