Nanolithography News RSS Feed - Nanolithography

Veeco Reports Significant Milestone in Ion Beam Deposition Systems for EUV Photomasks

Veeco Reports Significant Milestone in Ion Beam Deposition Systems for EUV Photomasks

Veeco Instruments Inc. announced today that its new Odyssey™ Ion Beam Deposition (IBD) Upgrade for the NEXUS® IBD-LDD™ System has repeatedly produced photomask blanks with zero deposition defects larger than 70 nanometers. This represents a significant milestone toward the manufacture of semiconductor devices with advanced extreme ultraviolet (EUV) lithography. [More]
Researchers Present Paper on Resistless Nanofabrication by Stencil Lithography

Researchers Present Paper on Resistless Nanofabrication by Stencil Lithography

Congratulations to Oscar Vazquez-Mena, Shenqi Xie and Guillermo Villanueva who co-authored a review paper about stencil lithography "Resistless nanofabrication by stencil lithography: A review" recently published on Microelectronic Engineering. [More]
New Report on Lithography, Deposition, and Etch Market for Flip Chip/WLP Manufacturing

New Report on Lithography, Deposition, and Etch Market for Flip Chip/WLP Manufacturing

Reportbuyer.com has added a new market research report: Lithography, Deposition, and Etch Market Analysis for Flip Chip/WLP Manufacturing [More]
Nanonex’s NX-B200 Full Wafer Nanoimprint Tool Purchased by East China University of Science and Technology

Nanonex’s NX-B200 Full Wafer Nanoimprint Tool Purchased by East China University of Science and Technology

Nanonex Corporation, the inventor of nanoimprint lithography and the world’s leading provider in nanoimprint lithography solutions with the longest history, announces the purchase of Nanonex’s NX-B200 system by East China University of Science and Technology (ECUST). [More]
temicon and holotools Join Forces to Speed up Market Introduction of Nanostructure Technologies

temicon and holotools Join Forces to Speed up Market Introduction of Nanostructure Technologies

The two German high-tech companies temicon GmbH and holotools GmbH join forces to expand their product portfolio in the area of micro and nanotechnologies. In the future they are going to operate under the corporate roof of temicon, continuing the well established brand “holotools” as their trademark for laser interference lithography. [More]
SEMICON West 2014: USHIO to Exhibit Lithography Tools for Advanced Packaging Applications

SEMICON West 2014: USHIO to Exhibit Lithography Tools for Advanced Packaging Applications

USHIO INC. (President and CEO: Shiro Sugata) today announced that at SEMICON West 2014 (Booth #2105) the company will exhibit a series of its lithography tools for advanced packaging applications, including the UX7-3Di LIS 350 stepper for 3D/2.5D silicon interposers, through a panel display as well as propose solutions for the challenges of next-generation packaging applications. SEMICON West 2014 is being held on July 8 through July 10 at Moscone Center in San Francisco, California. [More]
NSF Awards Grant for Study of Complex Physical and Chemical Reactions in Lithography Systems

NSF Awards Grant for Study of Complex Physical and Chemical Reactions in Lithography Systems

Have you ever wondered how the tiny components and devices inside your cell phone are made? [More]
EV Group Unveils GEMINI FB XT Fusion Wafer Bonding Platform

EV Group Unveils GEMINI FB XT Fusion Wafer Bonding Platform

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the GEMINI®FB XT—its next-generation fusion wafer bonding platform, which combines several performance breakthroughs to move the semiconductor industry closer to the goal of high-volume manufacturing (HVM) of 3D-ICs with through-silicon vias (TSVs). [More]
ZEISS Introduces Next Generation of Photomask Qualification System, AIMS 1x-193i

ZEISS Introduces Next Generation of Photomask Qualification System, AIMS 1x-193i

ZEISS introduces the next generation of photomask qualification system AIMS™ 1x-193i at this year´s European Mask and Lithography Conference (EMLC) in Dresden. ZEISS has experience in aerial imaging technology and AIMS™ for more than 20 years and has become a defacto-industry standard for printability analysis of mask defects. [More]
SUSS MicroTec Qualifies DSC300 Gen2 Projection Lithography System for Volume Production

SUSS MicroTec Qualifies DSC300 Gen2 Projection Lithography System for Volume Production

SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, has successfully qualified its new DSC300 Gen2 projection lithography system for volume production at a major Asian packaging house (OSAT). [More]