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Mycronic Receives Another Order for Prexision Platform-Based Mask Writer

Mycronic Receives Another Order for Prexision Platform-Based Mask Writer

Mycronic AB (publ), has received yet another order for a mask writer, built on the Prexision platform, replacing an older system for manufacturing of display photomasks. The system, sold to a customer in Asia, is scheduled to be delivered during the second half of 2016. [More]
Changchun Institute Places Order for Eulitha PHABLE Photolithography System

Changchun Institute Places Order for Eulitha PHABLE Photolithography System

EULITHA, a Swiss startup company offering innovative lithography equipment and services for the nanotechnology, photonics and optoelectronic markets announced today that it received a new order for its unique PhableR 100 photolithography tool from the Changchun Institute of Optics, Fine Mechanics and Physics (CIOMP), China. [More]

Suss MicroTec and University of Pennsylvania Announce New Center for Nanoimprint Lithography in North America

SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, and the Singh Center for Nanotechnology at the University of Pennsylvania (Penn) are announcing a cooperation agreement in the field of nanoimprint technologies. [More]
Asian Display Photomasks Manufacturer Places Order for Mycronic Mask Writer

Asian Display Photomasks Manufacturer Places Order for Mycronic Mask Writer

Mycronic AB (publ), has received an order for a mask writer replacing an older system for manufacturing of display photomasks from a customer in Asia. It is estimated that the system will be delivered during the third quarter of 2016. [More]
New Report on Global Market for Zinc Oxide Nanoparticles 2015

New Report on Global Market for Zinc Oxide Nanoparticles 2015

Research and Markets has announced the addition of the "The Global Market for Zinc Oxide Nanoparticles 2015" report to their offering. [More]
Rudolph JetStep W2300 Advanced Packaging Lithography System Selected by Leading Taiwan-Based OSAT

Rudolph JetStep W2300 Advanced Packaging Lithography System Selected by Leading Taiwan-Based OSAT

Rudolph Technologies, Inc. announced today that a leading Taiwan-based outsourced assembly and test (OSAT) manufacturer has selected the JetStep?W2300 Advanced Packaging Lithography System for the development of next-generation advanced packaging technology. [More]
Polymer Mold Forms Perfect 3D-Structured Single-Crystal Nanostructures

Polymer Mold Forms Perfect 3D-Structured Single-Crystal Nanostructures

Polymer engineers from Cornell University have created a novel mold for nanostructures which is capable of forming liquid silicon from organic polymer materials. [More]
Asian Customer Places Order for Mycronic FPS Mask Writer

Asian Customer Places Order for Mycronic FPS Mask Writer

Mycronic AB, has received order for an FPS mask writer within the multi purpose segment from a customer in Asia. The system is scheduled for delivery in mid-2016. [More]
SUSS MicroTec, Georgia Tech Enter Collaboration for Nanotechnology, Bio-Medical and Semiconductor 3D Packaging Research

SUSS MicroTec, Georgia Tech Enter Collaboration for Nanotechnology, Bio-Medical and Semiconductor 3D Packaging Research

SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, and the Georgia Institute of Technology (Georgia Tech) announced today a collaboration for nanotechnology, bio-medical and semiconductor 3D packaging research. [More]
KAIST Develops Flexible PRAM Enabled By Self-Assembled BCP Silica Nanostructures

KAIST Develops Flexible PRAM Enabled By Self-Assembled BCP Silica Nanostructures

Phase change random access memory (PRAM) is one of the strongest candidates for next-generation nonvolatile memory for flexible and wearable electronics. In order to be used as a core memory for flexible devices, the most important issue is reducing high operating current. The effective solution is to decrease cell size in sub-micron region as in commercialized conventional PRAM. However, the scaling to nano-dimension on flexible substrates is extremely difficult due to soft nature and photolithographic limits on plastics, thus practical flexible PRAM has not been realized yet. [More]