Nanolithography News RSS Feed - Nanolithography

Atomic Force Microscopy Etches Nanoscale Patterns on Conductive Polymers

Atomic Force Microscopy Etches Nanoscale Patterns on Conductive Polymers

Researchers at Oak Ridge National Laboratory (ORNL) have successfully carved out nanoscale designs on polymer surfaces using atomic force microscopy (AFM). [More]
Nanolithography Technique Uses Nanoscale Spheres to Create 3D Nanostructures

Nanolithography Technique Uses Nanoscale Spheres to Create 3D Nanostructures

A new nanolithography technique that uses nanoscale polystyrene spheres to create 3D nanostructures for biomedical, photonic and electronic applications has been developed by researchers at the North Carolina State University (NC State). [More]
EV Group Dedicates NILPhotonics Competence Center for Nanoimprint Lithography Solutions

EV Group Dedicates NILPhotonics Competence Center for Nanoimprint Lithography Solutions

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has established the NILPhotonics™ Competence Center, which is designed to assist customers in leveraging EVG's suite of nanoimprint lithography (NIL) solutions to enable new and enhanced products and applications in the field of photonics. [More]
A*STAR’s Flexure-Based Electromagnetic Linear Actuator Wins Prestigious R&D Award

A*STAR’s Flexure-Based Electromagnetic Linear Actuator Wins Prestigious R&D Award

A Flexure-Based Electromagnetic Linear Actuator (FELA) developed by the Singapore Institute of Manufacturing Technology (SIMTech), a research institute of the Agency for Science, Technology and Research (A*STAR), is the only locally-developed innovation featured in the 2014 R&D 100 Awards, an international competition that recognises the 100 most technologically-significant products introduced into the marketplace over the past year. [More]
Mapper Lithography Selects SPTS’ Etch and PECVD Systems for New Fab in Moscow

Mapper Lithography Selects SPTS’ Etch and PECVD Systems for New Fab in Moscow

SPTS Technologies, an Orbotech company and a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced that Mapper Lithography has selected SPTS’ etch and low temperature chemical vapor deposition (CVD) systems on a Versalis fxP multi-technology platform for their new fab in Moscow. [More]
New Superfast 4G High-Volume, In-Line, 3D Topography Inspection System from Ultratech

New Superfast 4G High-Volume, In-Line, 3D Topography Inspection System from Ultratech

Ultratech, Inc., a leading supplier of lithography, laser-processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs), today introduced the Superfast 4G high-volume, in-line, 3D topography inspection system. [More]
SMIC Signs Volume Purchase Agreement with ASML for Lithography Systems

SMIC Signs Volume Purchase Agreement with ASML for Lithography Systems

Semiconductor Manufacturing International Corporation the largest and most advanced pure-play foundry provider in China, and ASML Holding N.V., the world's leading provider of lithography systems, announce the signing of a volume purchase agreement (VPA) that will provide SMIC with lithography systems from ASML. [More]
Adlyte Reaches Key Performance Benchmark for EUV Light Source for High-Volume Manufacturing

Adlyte Reaches Key Performance Benchmark for EUV Light Source for High-Volume Manufacturing

Adlyte Inc., a developer of high-brightness extreme light sources for advanced semiconductor inspection and metrology applications, today announced it has reached a key performance benchmark for its extreme ultraviolet (EUV) light source for high-volume manufacturing (HVM)-readiness. [More]
Gigaphoton Reaches Milestone in Continuous Operation of Prototype LPP EUV Light Source

Gigaphoton Reaches Milestone in Continuous Operation of Prototype LPP EUV Light Source

Gigaphoton Inc., a major lithography light source manufacturer, announced today that it has succeeded in achieving 3-hour continuous operation of its prototype LPP EUV light source at 50% duty cycle and 42-W output, equivalent to usage in a high-volume-manufacturing (HVM) environment. [More]
New Report on Lithography, Deposition, and Etch Market Analysis for Flip Chip/WLP Manufacturing

New Report on Lithography, Deposition, and Etch Market Analysis for Flip Chip/WLP Manufacturing

Flip chips are appearing in a plethora of high-volume consumer products such as mobile phones, digital cameras, MP3 players, and computer peripherals. Wafer-level packaging (WLP), the fabrication of the package directly on the wafer, is experiencing exceptional growth and stands out as one of the bright growth areas in electronics today. [More]