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Gigaphoton Reaches Milestone in Continuous Operation of Prototype LPP EUV Light Source

Gigaphoton Reaches Milestone in Continuous Operation of Prototype LPP EUV Light Source

Gigaphoton Inc., a major lithography light source manufacturer, announced today that it has succeeded in achieving 3-hour continuous operation of its prototype LPP EUV light source at 50% duty cycle and 42-W output, equivalent to usage in a high-volume-manufacturing (HVM) environment. [More]
New Report on Lithography, Deposition, and Etch Market Analysis for Flip Chip/WLP Manufacturing

New Report on Lithography, Deposition, and Etch Market Analysis for Flip Chip/WLP Manufacturing

Flip chips are appearing in a plethora of high-volume consumer products such as mobile phones, digital cameras, MP3 players, and computer peripherals. Wafer-level packaging (WLP), the fabrication of the package directly on the wafer, is experiencing exceptional growth and stands out as one of the bright growth areas in electronics today. [More]
Nano-Lithography Enables Precise ‘Writing’ and ‘Positioning’ of Lipid Membrane Fragments

Nano-Lithography Enables Precise ‘Writing’ and ‘Positioning’ of Lipid Membrane Fragments

Scientists from the University of Leeds have taken a crucial step forward in bio-nanotechnology, a field that uses biology to develop new tools for science, technology and medicine. [More]
New Automated High-Vacuum Wafer Bonding System from EV Group

New Automated High-Vacuum Wafer Bonding System from EV Group

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG®580 ComBond®¯a high-vacuum wafer bonding system, which enables electrically conductive and oxide-free covalent bonds at room temperature. [More]
CiS Research Institute Places Order for USHIO’s Large-Area, Full-Field Projection Lithography System

CiS Research Institute Places Order for USHIO’s Large-Area, Full-Field Projection Lithography System

USHIO INC. today announced that the company has received an order for its UX4 large-area, full-field projection lithography from a German research institute, CiS Forschungsinstitut für Mikrosensorik und Photovoltaik GmbH (hereafter CiS), through its wholly owned subsidiary USHIO EUROPE B.V. [More]
Veeco Reports Significant Milestone in Ion Beam Deposition Systems for EUV Photomasks

Veeco Reports Significant Milestone in Ion Beam Deposition Systems for EUV Photomasks

Veeco Instruments Inc. announced today that its new Odyssey™ Ion Beam Deposition (IBD) Upgrade for the NEXUS® IBD-LDD™ System has repeatedly produced photomask blanks with zero deposition defects larger than 70 nanometers. This represents a significant milestone toward the manufacture of semiconductor devices with advanced extreme ultraviolet (EUV) lithography. [More]
Researchers Present Paper on Resistless Nanofabrication by Stencil Lithography

Researchers Present Paper on Resistless Nanofabrication by Stencil Lithography

Congratulations to Oscar Vazquez-Mena, Shenqi Xie and Guillermo Villanueva who co-authored a review paper about stencil lithography "Resistless nanofabrication by stencil lithography: A review" recently published on Microelectronic Engineering. [More]
New Report on Lithography, Deposition, and Etch Market for Flip Chip/WLP Manufacturing

New Report on Lithography, Deposition, and Etch Market for Flip Chip/WLP Manufacturing

Reportbuyer.com has added a new market research report: Lithography, Deposition, and Etch Market Analysis for Flip Chip/WLP Manufacturing [More]
Nanonex’s NX-B200 Full Wafer Nanoimprint Tool Purchased by East China University of Science and Technology

Nanonex’s NX-B200 Full Wafer Nanoimprint Tool Purchased by East China University of Science and Technology

Nanonex Corporation, the inventor of nanoimprint lithography and the world’s leading provider in nanoimprint lithography solutions with the longest history, announces the purchase of Nanonex’s NX-B200 system by East China University of Science and Technology (ECUST). [More]
temicon and holotools Join Forces to Speed up Market Introduction of Nanostructure Technologies

temicon and holotools Join Forces to Speed up Market Introduction of Nanostructure Technologies

The two German high-tech companies temicon GmbH and holotools GmbH join forces to expand their product portfolio in the area of micro and nanotechnologies. In the future they are going to operate under the corporate roof of temicon, continuing the well established brand “holotools” as their trademark for laser interference lithography. [More]