NexPlanar, builds
the next generation of chemical mechanical planarization (CMP) pads for the
semiconductor device industry, has introduced the Element™ family of CMP
pads designed to deliver high removal rates, excellent planarization and exceptionally
low defectivity. NexPlanar utilized its newly developed hybrid polymer technology
in concert with patented in-situ molded groove technology to produce a new line
of hard and semi-hard pads that provide a level of defectivity performance not
available with industry-standard products.
The new line of pads is available with various groove types and groove depths,
including NexPlanar's proprietary "S-Groove" design, to provide excellent
uniformity, pad life and low cost-of-ownership.
Defectivity Reduction
The Element™ line combines the removal rate and planarization benefits
generally associated with hard pads with the lower defectivity levels of softer
pads. Customers now sampling the Element line have confirmed the high removal
rates, excellent planarization and in some cases, defectivity levels at one-tenth
the levels observed on traditional hard pads.
While the pads will be typically sold in standard configurations, NexPlanar
is able to modulate pad properties, such as pad hardness, pore size and pore
density, to develop customized solutions for demanding applications and integration
schemes, including those for emerging technologies.
"We work in a relatively conservative industry when it comes to change,"
commented Jim LaCasse, NexPlanar president and CEO. "However, the semiconductor
industry continues to need lower defectivity and lower cost-of-ownership products
in both mature and advanced manufacturing operations. We at NexPlanar are especially
pleased with the response to our Element product line, which enables our customers
to convert from industry standard hard pads with little or no change to their
tool settings or related consumables, such as conditioner disks. As a result
they can reduce their costs and improve yields with minimal expenditure of resources."
The Element pads are now available for sampling and the product line will be
commercially available worldwide for a variety of applications in late Q4 2009.
Posted October 27th, 2009
