Site Sponsors
  • Strem Chemicals - Nanomaterials for R&D
  • Oxford Instruments Nanoanalysis - X-Max Large Area Analytical EDS SDD
  • Park Systems - Manufacturer of a complete range of AFM solutions

Joint Development Research Focuses on 3D TSV Process Control

Published on April 20, 2009 at 4:20 PM

Rudolph Technologies, Inc. (NASDAQ: RTEC) and SEMATECH, the global consortium of leading chipmakers, announced today that Rudolph has joined SEMATECH's 3D Interconnect Program at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany. The joint partnership is a continuation of collaborative efforts in process characterization, with a new focus on 3D IC (three-dimensional integrated circuits) processing and enhancing process control of TSV (through-silicon vias) manufacturing. This is the second year that Rudolph will serve as a Member of SEMATECH.

As a member of SEMATECH's 3D program, Rudolph's inspection and metrology technologies will be applied to various projects including via depth and CD metrology, metallization void detection, stacked wafer via alignment, wafer edge defect detection and bump height coplanarity.

"The advanced device design and complex manufacturing requirements of 3D packaging opens a new frontier of process control challenges. Rudolph is well positioned, both with existing and emerging technologies, to be the semiconductor industry's premier TSV process control solution provider," stated Ardy Johnson, Rudolph's vice president of marketing.

Sitaram Arkalgud, director of 3D interconnect at SEMATECH added, "We are pleased to welcome Rudolph as a partner. Rudolph's proven expertise in defect detection, characterization, and data analysis will be significant in developing technologies and processes that will continue to drive implementation of manufacturable and cost-effective 3D TSV processes."

Richard Brilla, vice president for strategy, alliances and consortia at CNSE, said, "The addition of Rudolph Technologies' innovative metrology and characterization capabilities will further enhance the leading-edge research being conducted as part of SEMATECH's 3D Interconnect Program at CNSE's Albany NanoTech. At the same time, it will build on the world-class research and development at the UAlbany NanoCollege, which is providing critical solutions for the world's leading companies in the highly competitive global nanoelectronics industry."

Tell Us What You Think

Do you have a review, update or anything you would like to add to this news story?

Leave your feedback
Submit