Electro Scientific Industries,
Inc. (Nasdaq:ESIO), a leading provider of world-class photonic systems for
microengineering, today announced that it has bolstered its technology offerings
for both its 3D IC packaging and memory repair product applications.
Through the acquisition of thin wafer dicing and TSV drilling intellectual
property (IP) rights of Xsil, ESI has enhanced its technology and product portfolio
to enable competitive advantages for its customers for 3D IC packaging applications.
The acquired assets further strengthen ESI’s 3D IC packaging offerings
with full laser-dicing capability for thin wafers as well as fine pitch through-silicon
via (TSV) drilling.
In addition, ESI’s recent introduction of an innovative new memory repair
system, the 9850TP, reflects continued leadership in memory repair applications.
ESI’s 9850 Tailored Pulse laser repair system was recently qualified by
a major DRAM manufacturer for next generation DRAM devices. ESI’s customers
realize tremendous cost and technology advantages due to its expanded memory
repair product line.
“ESI is committed to advancing our customers’ product and technology
roadmaps,” said Louis Vintro, vice president and general manager of ESI’s
semiconductor products group. “To do this, we are continually investing
in R&D to provide new, innovative solutions that improve our customers’
manufacturing efficiencies. The IP acquisition in 3D IC packaging technology
and the selection of our 9850TP laser system demonstrate ESI’s ongoing
commitment to meet future challenges in semiconductor manufacturing.”
ESI will be at SEMICON West 2009
To learn more about the latest innovations, visit ESI at Booth #2406, in the
South Hall during SEMICON West 2009 held July 14-16 at San Francisco’s
Moscone Convention Center.