Entegris Inc. (Nasdaq:ENTG) will join leading lithography technologists
from around the world at the 2010 SPIE Advanced Lithography event Feb. 21 through
Feb. 25 in San Jose, Calif.
Specializing in advanced contamination control and microenvironment solutions,
Entegris (Booth 120) will present new technical papers and showcase its product
portfolio for addressing the most prevalent production challenges in advanced
lithography applications, including solutions for:
- Microbridge defects. Entegris offers the IntelliGen® Mini photochemical
dispense system to isolate filtration from dispense, helping reduce or eliminate
defects during point-of-use photochemical dispense applications without sacrificing
dispense repeatability. In addition, the Impact® 5 nm asymmetric UPE and
10 nm Duo photochemical filters employ a surface-modified UPE membrane technology
to help minimize chemical exposure.
- Reticle haze defects. With the Clarilite® reticle haze prevention system,
Entegris controls haze formation to extend reticle life by reducing the need
for frequent cleaning, increasing yield and significantly reducing reticle
costs. The system includes the RSP3 reticle pod, RSPX manual purge station,
RSPX direct purge cabinet, and the XCDA auto regeneration system.
- Lens haze defects. Entegris offers the Aeronex® gas purification system
and the GateKeeper® point-of-use purifier to help remove contaminants
in lithography applications using an inorganic regenerable media to purify
gas at ambient temperatures to the sub-parts-per-billion (ppb) level.
- Extreme ultra violet (EUV) applications. Entegris also will display several
product solutions that help microchip manufacturers adopt emerging EUV manufacturing
practices, including the Entegris® EUV reticle pod, pHasor® II bubble-free
gasification module, and the Controlled DI water regasification system with
Entegris experts also have authored or collaborated with other industry and
research leaders on eight newly-available technical papers and posters focused
on solving these critical contamination control challenges. Presentations at
the SPIE event include:
- "Considerations for chemical filter performance for low-molecular
weight silicon AMC" - Tuesday, Feb. 23, at 6 p.m. in Convention
Center Exhibit Hall 2. Focused on reducing lens haze defects.
- "Reticle haze control: global update and technology roadmap"
- Wednesday, Feb. 24, at 11:40 a.m. in Convention Center A1. Focused
on reducing reticle haze defects.
- "Further analysis of the effect of point-of-use filtration on microbridging
defectivity" - Tuesday, Feb. 23, at 6 p.m. in Convention Center
A4. Focused on reducing microbridge defects.
- "Immersion lithography microbridge defects: characterization and root
cause analysis" - Tuesday, Feb. 23, at 6 p.m. in Convention Center
Exhibit Hall 2. Focused on reducing microbridge defects.
- "Particle protection capability of SEMI compliant EUV dual pod"
- Wednesday, Feb. 24, at 6 p.m. in Convention Center A4. Focused on
enabling EUV applications.
- "Improving material-specific dispense processes for low-defect coatings"
- Tuesday, Feb. 23, at 6 p.m. in Convention Center A4. Focused on achieving
- "Point-of-use filtration methods to reduce defectivity" -
Tuesday, Feb. 23, at 6 p.m. in Convention Center A4. Focused on achieving
- "Defect performance of a 2X-node resist with a revolutionary point-of-use
filter" - Tuesday, Feb. 23, at 6 p.m. in Convention Center A4.
Focused on achieving process improvements.