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Posted in | Nanoelectronics

CEA-Leti Co-Sponsors 2010 IEEE International Conference on IC Design and Technology

Published on May 12, 2010 at 7:18 AM

CEA-Leti, a co-sponsor with IEEE France Section of the 2010 IEEE International Conference on IC Design and Technology, said today the June 2-4 event will provide an opportunity for the traditionally separated design and process-technology communities to share ideas on product development and manufacturing.

The conference will present the latest findings in accelerating device time to market through implementing new designs and technologies in manufacturing, including design and development of advanced devices and materials, and IC and device reliability.

Held this year at MINATEC in Grenoble, ICICDT encourages professionals from the multi-disciplinary fields of advanced IC design, device design, design tools/technology and process-technology development to share their expertise on ways to speed commercialization, especially for products incorporating advanced management of power, leakage, device degradation and yield.

“This conference is a global forum intended for engineers, researchers, and managers working in all phases of semiconductor development, including design, device architectures, manufacturing process integration, and reliability,” said Marc Belleville, ICICDT 2010 conference chair. “A major strategic focus will be bringing new products and technologies into manufacturing and the marketplace, including the design and development of advanced materials, device structures, and reliability.”

Keynote presentations include:

  • “Future Technology and Application of NAND Flash Memory. Masaki Momodomi, technology executive, flash memory, Toshiba Corp.
  • “Imaging Market Evolution and Its Products & Technological Implications.” Jean-Luc Jaffard, Emerging Markets and Image Signal Processing Business Unit director, Imaging Division, STMicroelectronics

ICICDT also will provide an environment that fosters the interactions of design and process technology on product/IC development and manufacturing. It will include two days of technical presentations and workshops. A one-day tutorial program on June 2 precedes the conference.

The conference, which will include participants from the U.S., Europe and Asia, is structured to encourage conversations among participants. Presentations will be limited to 10 minutes and there will be no parallel sessions. There also will be interactive sessions allowing scientists and industrial partners to discuss topics of interest in-depth.

Source: http://www.leti.fr/

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