By Cameron Chai
Rudolph Technologies proclaimed that it has delivered its multiple NSX Macro
Defect Inspection Systems, Wafer Scanner 3880 3D Inspection System and Discover
Yield Management Software Suite to a major semiconductor manufacturing company
for developing sophisticated three-dimensional IC integration using through
silicon via (TSV) based processes.

Wafer Scanner 3880 3D Inspection System and NSX 320 System (merge the two pictures into one)
The reasons behind the selection of the systems are their precision, speed
and flexibility for a variety of applications. The Wafer Scanner 3880 3D
Inspection System offers macro, RDL and bumps defect check during post-fab
processes and better yield management for two-dimensional/three-dimensional RDL
and bump metrology for both flip and standard chip wafers.
The Wafer Scanner System uses Rudolph Technologies’ patented Laser
Triangulation Technology, which makes the system to perform three-dimensional
inspection of various sizes of RDL and bumps at a high speed. The system’s
optional feature, ultra-high resolution sensor allows inspection of micro RDL
and bumps with heights down to 1µ.
The new NSX 320 System provides inspection solutions for the TSV-based
processes to link numerous die in one package, while offering services to
critical metrology and inspection solutions to sawn wafers on film frames,
wafer-to-wafer arrangement in thinning/back-grinding/bonding processes, X and Z
direction edge trimming metrology, die to wafer alignment and via
dimensions.
Rudolph Technologies’ inline defect study and data management solution,
Discover Yield Management Software is developed to manage sophisticated macro
edge, frontside and backside inspection outcomes. The suite’s integrated wafer
level ADC allows the software to quickly detect destructive killer defects that
can damage the whole wafer. The failure of the device can now be allied to edge
and backside defects in one intuitive screen. The excursion detection
functionality of the software can automatically trigger alarms and user-defined
macros that replicate expert decision-making steps. The company’s Harmony ASR
Software helps its yield management portfolio by offering quick, all-surface
inspection and categorization to augment inspection and categorization
yields.
Source: http://www.rudolphtech.com