Brewer Science, Inc., a global leading innovator and manufacturer of
specialty materials, process solutions, and equipment for the microelectronics
industry, and EV Group (EVG), a leading supplier of wafer bonding and
lithography equipment for the MEMS, nanotechnology, and semiconductor markets,
today announced an agreement on ZoneBOND(TM) technology.
The agreement will enable both companies to commercialize the groundbreaking
technology for customers in the temporary wafer bonding market.
The ZoneBOND(TM) technology provides a breakthrough approach for temporary
wafer bonding, thin wafer processing, and debonding applications which overcomes
the last remaining limitations associated with thin wafer processing.
ZoneBOND(TM) technology allows the use of silicon, glass, and other carriers, is
compatible with existing, field-proven adhesive platforms, and enables debonding
at room temperature with virtually no vertical force being applied to the device
To support grinding and backside processing at high temperatures and to allow
for low-force carrier separation, ZoneBOND(TM) defines two distinctive zones on
the carrier wafer surface with strong adhesion in the perimeter (edge zone) and
minimal adhesion in the center zone. Therefore, only low separation force is
required for carrier separation once the polymeric edge adhesive has been
removed by solvent dissolution or other means.
"We are delighted to be able to bring the exciting ZoneBOND(TM) temporary
bonding and debonding technology to the market," said Dr. Terry Brewer, founder,
CEO, and president of Brewer Science. Paul Lindner, executive technology
director of EV Group, added, "Combining Brewer Science's advanced material
development and process integration and EVG's field-proven equipment and process
solutions, ZoneBOND(TM) will enable customers to achieve a quantum leap in thin