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EV Group and Brewer Science to Commercialize Breakthrough Temporary Wafer Bonding Technology

Published on October 20, 2011 at 7:40 PM

Brewer Science, Inc., a global leading innovator and manufacturer of specialty materials, process solutions, and equipment for the microelectronics industry, and EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology, and semiconductor markets, today announced an agreement on ZoneBOND(TM) technology.

The agreement will enable both companies to commercialize the groundbreaking technology for customers in the temporary wafer bonding market.

The ZoneBOND(TM) technology provides a breakthrough approach for temporary wafer bonding, thin wafer processing, and debonding applications which overcomes the last remaining limitations associated with thin wafer processing. ZoneBOND(TM) technology allows the use of silicon, glass, and other carriers, is compatible with existing, field-proven adhesive platforms, and enables debonding at room temperature with virtually no vertical force being applied to the device wafer.

To support grinding and backside processing at high temperatures and to allow for low-force carrier separation, ZoneBOND(TM) defines two distinctive zones on the carrier wafer surface with strong adhesion in the perimeter (edge zone) and minimal adhesion in the center zone. Therefore, only low separation force is required for carrier separation once the polymeric edge adhesive has been removed by solvent dissolution or other means.

"We are delighted to be able to bring the exciting ZoneBOND(TM) temporary bonding and debonding technology to the market," said Dr. Terry Brewer, founder, CEO, and president of Brewer Science. Paul Lindner, executive technology director of EV Group, added, "Combining Brewer Science's advanced material development and process integration and EVG's field-proven equipment and process solutions, ZoneBOND(TM) will enable customers to achieve a quantum leap in thin wafer processing."

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