3M and EV Group (EVG) have
agreed to settle the patent infringement litigation brought by EVG against 3M
in the U.S. District Court for the Southern District of New York relating to
systems for temporary wafer bonding.
Under the terms of the settlement, the details of which are confidential, 3M,
its customers, and 3M’s licensed suppliers of 3M's Wafer Support System
will continue to make, sell and use the Wafer Support System in global semiconductor
and packaging markets. EVG will continue to defend its patent portfolio and
protect its intellectual property.