UMC (NYSE: UMC; TSE: 2303),
a leading global semiconductor foundry, today announced that it has delivered
customer ICs produced on its High Performance (HP) 40nm process technology.
The products were manufactured with excellent cycle time and yields for the
large die-size programmable logic chips, which leveraged the foundry's triple-gate
oxide, 12 metal layers and copper/low-k technology to enable 65% reduced power
consumption and more than twice the density improvement over previous 65nm generation
products. The advanced 40nm ICs have already begun shipping in volume to the
customer's end users for product sampling.
S.C. Chien, vice president of advanced technology development at UMC, said,
"UMC continues to remain at the forefront of semiconductor foundry technology
through the timely delivery of leading-edge processes that meet the demanding
requirements of today's advanced applications. The delivery of these 40nm customer
products underscores this technology commitment, we look forward to bringing
the performance advantages of our proven 40nm technology to even more UMC customers."
The high performance 45/40nm logic process is UMC's independently developed
technology that utilizes advanced immersion lithography and incorporates the
latest advancements such as ultra shallow junction, mobility enhancement techniques
and ultra low-k dielectrics for maximum power and performance optimization.
Multiple voltage and transistor options are available to satisfy the needs of
a wide range of applications including high speed, low power, and analog/RF
for system-on-chip designs. Currently, many customers have engaged with UMC
for their 45/40nm projects, with multiple product designs in various stages