the leading manufacturer of UV-visible-NIR microscopes and microspectrometers,
is pleased to announce the QDI 2010 Film microspectrophotometer. The
QDI 2010 Film instrument is designed to measure the thickness of thin
films of sub-micron sampling areas rapidly and non-destructively.
Able to analyze films of many materials on both transparent and opaque substrates,
the QDI 2010 Film™ enables the user to determine thin film thickness on
everything from semiconductors, MEMS devices, disk drives to flat panel displays.
When combined with CRAIC Technologies proprietary contamination imaging capabilities,
the QDI 2010 Film™ represents a major step forward in that it is designed
specifically for industrial processes.
"Many of our customers want to measure the thickness of thin films of
smaller and smaller sampling areas for rapid quality control of their products.
The QDI 2010 Film™ microspectrophotometer was built in response to customer
requests for a powerful, flexible film thickness tool that can measure sub-micron
areas on both transparent and opaque substrates. The QDI 2010 Film™ meets
those needs" says Dr. Paul Martin, President.
The complete QDI 2010 Film™ solution combines advanced microspectroscopy
with sophisticated software to enable the user to measure film thickness by
either transmission or reflectance of many types of materials and substrates.
Due to the flexibility of the CRAIC Technologies design, sampling areas can
range from over 100 microns across to less than a micron. Designed for the production
environment, it incorporates a number of easily modified processing recipes,
the ability to create new film recipes and sophisticated tools for analyzing
data. The ability to directly image and analyze films with ultraviolet microscopy
can also be added to this instrument.