SUSS MicroTec (FWB:SMH)(GER:SMH),
a supplier of innovative process and test solutions for the semiconductor industry
and related markets, has shipped a LithoPack300 lithography cluster to Japan.
The system has been successfully installed at the customer site where it will
be used for 3D integration technology development. The cluster solution with
coat, bake, expose and develop modules for wafers up to 300mm constitutes a
cost-efficient approach for the challenging Through-Silicon-Via (TSV) manufacturing
and backside redistribution layer (RDL) in 3D integration production. With this
integrated lithography solution and further solutions for permanent and temporary
wafer bonding SUSS MicroTec offers a complete process and technology portfolio
for 3D integration. SUSS MicroTec has recently announced its participation in
a range of research projects on 3D integration processes driving technology
advances from the equipment supplier side.
The LithoPack300 combines two 300mm photolithography modules in one system
and represents the most cost-efficient integrated lithography solution in the
market. The MA300 Gen2 module, a 300mm next generation mask aligner platform,
provides excellent back-side processing capabilities that enable highly accurate
photolithography processes for the manufacturing of back side redistribution
layers or TSV etch masks. The ACS300 module offers closed cover coating technology
and best-in-class edge bead removal precision and therefore enables optimum
thick resist processing for 3D integration processes.
“In recent years SUSS MicroTec lithography systems have developed into
an enabling platform for next generation 3D Integration technologies”,
said Rolf Wolf, general manager of SUSS MicroTec’s lithography division.
“Today SUSS Mask Aligners can be enhanced with tooling for submicron alignment,
wafer edge handling or UV-bonding for wafer to wafer stacking, all features
that have become critically important for 3D applications.
“With the involvement of SUSS MicroTec in international research cooperations
we are proud to become further involved in 3D integration process development.”
said Raymond Lau, Business Manager for SUSS MicroTec in Japan. “Our Japanese
customers will directly benefit from these technical advances. We enjoy being
able to offer a well-engineered solution portfolio for 3D integration that really
meets their specific needs.”