Core Wafer Systems, Inc. (CWS) and SEMATECH,
a global consortium of chipmakers, today announced that CWS has joined SEMATECH's
Front End Processes (FEP) program, and will work with SEMATECH to characterize
novel transistor processes, emerging technology devices and designs. The partnership
will focus on the development and verification of advanced test reliability
libraries.
As a member of SEMATECH's FEP program, CWS will collaborate with FEP
experts in the characterization arena to develop an analysis tool for reliability
testing of deep submicron devices. The tool set, an advanced deep submicron
reliability testing solution codenamed WARp, is, according to CWS CEO Roger
Goetz, “a quantum leap from current reliability products in terms of both
measurement capability and suitability to manufacturers addressing deep submicron
reliability.” WARp, which is scheduled for release in May 2010, is based
on CWS' proprietary parallel measurement scheme for physical phenomena
in semiconductor structures.
"SEMATECH is pleased to welcome CWS as a partner,” said Raj Jammy,
SEMATECH vice president of emerging technology. “CWS' proven expertise
in reliability data collection and analysis will complement our own technical
expertise, as we work together to develop technologies and processes that will
extend CMOS and pave the path for beyond CMOS technologies."
Dr. Gennadi Bersuker, Fellow of SEMATECH, added, "With each new technology
node, it is increasingly important to develop an adequate reliability analysis
methodology. CWS' reliability software capabilities will enable us to
create a comprehensive characterization software which addresses our industry's
manufacturing needs."