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Rudolph Technologies Receives Multiple Orders from Major Taiwanese Foundry

Published on December 8, 2009 at 6:39 PM

Rudolph Technologies, Inc. (NASDAQ: RTEC), a worldwide leader in process characterization solutions for the semiconductor manufacturing industry, announced today the receipt of multiple orders for its latest Explorer® Inspection Cluster from a major Taiwanese foundry. The orders include new systems as well as upgrades for previously installed equipment. The Explorer Cluster monitors defectivity in the Chemical Mechanical Polish (CMP) process module.

The Explorer System utilizes an AXi940™ module to inspect the front side of the wafer using enhanced capabilities specifically designed to meet the unique challenges of CMP inspection in a foundry. In addition to helping users solve CMP process variation challenges, the AXi940 module has the ability to quickly and automatically create inspection recipes without sample wafers. The time required for recipe creation is of utmost concern to foundry customers due to the wide variety of devices that they manufacture.

Scott Balak, Rudolph’s all-surface inspection product manager adds, “The Explorer System’s new waferless recipe creation capability was a key factor in this foundry’s purchase decision. With the Explorer Cluster creating recipes automatically, the customer benefits from both enhanced tool productivity as well as a more efficient use of their personnel and material.”

The Explorer Inspection Cluster is a modular approach to wafer inspection that may include one or more inspection modules for the wafer’s front, back or edge surfaces. Designed for maximum productivity and efficiency, the Explorer System incorporates up to four load ports using sophisticated queue management and features Discover® software, an inline defect analysis and data management system designed to seamlessly handle advanced macro defect inspection results. When the E30™ (edge) and B30™ (backside) inspection modules are paired with the AXi940 frontside module, correlation of defect data from all surfaces provides faster, more efficient response to defectivity issues.

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