NILCom to Exhibit at nano tech 2010

NILCom, a nanoimprint lithography consortium comprising companies and research organizations throughout the imprint lithography supply chain, will be exhibiting at nano tech 2010 held February 17-19 in Tokyo, Japan.

NILCom will present solutions and services, which will drive the further commercialization of nanoimprint lithography. Five consortium members will highlight the latest equipment, material and process developments at booth C 13.

The NILCom booth at nano tech 2010 will host the following consortium members:

• Applied MicroStructures Inc., Santa Clara, USA (www.appliedmst.com) Focus: Equipment and processes for functional coatings and anti-stiction layers
• EV Group (EVG), St. Florian/Inn, Austria (www.EVGroup.com) Focus: Equipment for all imprint lithography processes – incl. UV-NIL, HE and micro-contact printing
• micro resist technology GmbH, Berlin, Germany (www.microresist.de) Focus: Resists and working stamps for nanoimprint lithography
• NIL Technology ApS, Lyngby, Denmark (www.nilt.com) Focus: Stamps of all forms of nanoimprint lithography
• PVA TePla AG, Feldkirchen, Germany (www.pvatepla.com) Focus: NIL equipment for stamp cleaning and residual layer removal