SEMATECH today announced that Sitaram Arkalgud, director of 3D interconnect program at SEMATECH, will speak to leading technologists and electronics design suppliers attending the 47th Design Automation Conference (DAC) being held at the Anaheim Convention Center in Anaheim, CA, on June 13-18, 2010.
As a participant in the DAC panel “EDA Challenges and Options: Investing for the Future,” Dr. Arkalgud will provide the top challenges from a technology/manufacturing perspective on Tuesday, June 15, at 10:30am. Dr. Arkalgud will join other representatives of major Electronic Design Automation (EDA) stakeholders, including customers, EDA companies, technology providers, and the research community to forecast the direction in which the EDA industry is headed, in the face of unprecedented technological, economic and business challenges.
“I am delighted to participate in this panel discussion, and to share with the design community SEMATECH’s perspectives on critical challenges in advanced technology development with 3D TSV interconnects as an example,” said Sitaram Arkalgud, director of 3D Interconnect of SEMATECH. “In an era of tough technical and financial choices, we all share a common objective – to design and develop world-class products that are ultimately both manufacturable and affordable. Critical topics such as convergent product and technology roadmaps, standards, co-design and process variability all need to be discussed across the breadth of our industry. This event offers an excellent opportunity to promote dialogue and forge consensus among the various sectors of our industry.”
The DAC is recognized as the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. A diverse worldwide community representing more than 1,000 organizations attends each year, represented by system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities. Close to 60 technical sessions selected by a committee of electronic design experts offer information on recent developments and trends, management practices and new products, methodologies and technologies. The conference is sponsored by the Association of Computing Machinery/Special Interest Group on Design Automation (ACM/SIGDA), the EDA Consortium, and the IEEE Council on Electronic Design Automation (CEDA).