EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has introduced the EVG610 mask and bond aligner, specifically to address its university and research customers' demands for a lower costing system with greater process versatility.
Complementing the EVG501 Ramped wafer bonder launched a year ago, the EVG610 is specifically designed to provide wider access to EVG's core alignment technology platform used throughout its latest mask and bond aligner systems.
Designed to offer the flexibility of its industry-proven EVG620 automated mask and bond aligner, which is targeted for volume production, the EVG610 eliminates costly features, such as automation, which may not be needed in a research facility.
EVG executive technology director, Paul Lindner, commented, "e Group has been working with research facilities for 30 years, giving us insight into the unique requirements of smaller-scale university research and production facilities. That is why we continue to roll out products like the EVG610 to make sure that students and first-time users have access to affordable systems with superior technology features that may not otherwise be available in lower-cost models. This latest addition is an integral part of our mask aligner and bond aligner product families, and completes our portfolio spanning the entire manufacturing chain--from Ramped all the way to full-scale, high-volume production environments. quot;
Facing greater budget constraints, universities and research institutions are compelled to purchase equipment with more flexibility that will enable them to scale processes across multiple research projects and applications.
Cost and system flexibility--without sacrificing quality results--are key factors in their decision-making processes. EVG's new, lower-cost system provides mask alignment technology with the highest overlay accuracy enabling the best possible exposure, while its bond alignment capability offers alignment accuracy that maximizes process windows--both ensuring higher yields. What's more, the EVG610 enables researchers to seamlessly migrate their processes to volume production environments.
EVG610 Ramped System Features
The EVG610 mask and bond alignment system is a highly flexible Ramped system that can process substrate pieces and wafers up to 200 mm. This mask and bond aligner system is designed to support a wide variety of processes such as UV-nanoimprint lithography (UV-NIL) and fine patterning, wafer bumping and chip-scale packaging for MEMS, integrated circuit and compound semiconductor devices.
The EVG610 system offers core technologies from EVG's high-volume mask and bond alignment systems including:
- Option to combine mask and bond alignment capabilities optimizes total
cost of ownership (TCO)--reduces investment, footprint and operation
cost compared to two separate systems
- Flexible configurations available from pieces up to 4-, 6- or 8-inch
- Bottom-side alignment capability, supporting back side lithography and
bond alignment processes
- Unmatched exposure light uniformity at wafer level (down to +/-1.5
- Processes are fully compatible to EVG production mask and alignment
- Flexible multi-user system with multi-language capability
- Maintenance-free and high-precision monolithic air bearing stage
- Windows®-based user interface