Nanometrics Incorporated (Nasdaq: NANO), a leading provider of advanced process control metrology systems, today announced that a leading manufacturer of advanced logic devices has taken delivery of its next generation UniFire 7900IR metrology system for 3D inspection of wafer-scale packaging features as well as registration for wafer-to-wafer bonding applications for use in advanced wafer scale packaging process control.
"Careful control of lithography and etching in the Through Silicon Via (TSV) flow, bumping, and wafer-to-wafer bonding processes is critical to enable high yielding devices for next generation advanced packaging.
This latest system offers a new 3D inspection capability as well as an infra-red (IR) microscope option allowing direct measurement of features and structures in bonded wafer stacks, effectively seeing through the wafers," commented Dr. Michael Darwin, Vice President of the UniFire and Materials Characterization Groups at Nanometrics.
"The UniFire's full surface topography metrology capability has secured it as the tool of choice for process control metrology in wafer scale packaging. With this new capability, Nanometrics expands the market and applications for the Unifire to include full 3D inspection of devices fabricated using advanced packaging technologies."
Existing UniFire systems can be field upgraded with both IR and 3D inspection options to further extend the capability of installed tools.