New Partnership to Advance Wafer-Level Processing for 3D ICs and MEMS

Published on November 17, 2011 at 1:23 AM

By Cameron Chai

SVTC Technologies, a company specializing in nanotechnology advancement and commercialization, has announced a partnership with SUSS MicroTec, an equipment supplier for MEMS and sophisticated three-dimensional integrated circuit (IC) integration.

This partnership is for the advancement of wafer-level processing for three-dimensional IC integrated solution and MEMS with special focus on the latest bonding applications required for the development of future-generation electronics. This collaboration is part of SVTC Technologies’ ongoing strategy to offer value-added systems to its customers.

SUSS MicroTec has supplied bonding and alignment equipment to SVTC Technologies’ advanced round-the-clock cleanrooms situated in San Jose, California. Through this partnership, common customers of the two companies can now create new processes and test out devices, while carrying out their own production works. As part of the deal, the two companies will join hands in the development and characterization of novel wafer-bonding and lithography technologies.

SVTC Technologies offers a broad array of solutions through a select strategic partner network and proprietary capabilities. On the basis of its expertise, the company has formed an ecosystem of valued partners to support the company’s ability to offer a comprehensive range of technology advancement services.

The President and Chief Executive Officer at SUSS MicroTec, Frank P. Averdung stated that the company’s collaboration with SVTC Technologies will target the advancement of new solutions and processes in the wafer-level processing field. The Chief Executive Officer at SVTC Technologies, Bert Bruggeman stated that the SUSS MicroTec partnership will complement the company’s capability to meet its customers’ requirements for sophisticated MEMS production technology.

Source: http://www.svtc.com

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