Sep 4 2014
Kilopass Technology Inc., a leading provider of semiconductor logic embedded non-volatile memory (eNVM) intellectual property (IP), today announced successful TSMC9000 qualification of its XPM one-time programmable (OTP) antifuse eNVM IP core.
Kilopass eNVM IP provides cost-effective storage for applications that require few if any changes over the life of a product such as: boot code; encryption keys; and parametric data storage.
Kilopass antifuse technology in TSMC 55HV offers four major advantages over floating gate flash technology. First, unlike floating gate that is sensitive to temperature, antifuse offers wide temperature tolerance. Second, while floating gate requires an added wafer bake at 250°C to guarantee data retention, antifuse requires no additional back end manufacturing steps. Third, the antifuse bitcell follows Moore's Law and scales to higher capacity at no added cost, unlike flash. Finally, antifuse technology benefits from the thinner oxides provided by advanced processes using metal gates.
"Kilopass is extremely pleased to have completed TSMC9000 qualification of our XPM product line in TSMC's 55nm HV process," said Linh Hong, Vice President of Marketing and Business Development at Kilopass. "TSMC qualification is one of the most comprehensive and thorough testing our IP must pass and our engineering team continues to execute to these high standards. This compliance assures our SoC customers excellent plug and play experience when they submit their design to TSMC for fabrication."
"TSMC's 55nm HV process is seeing strong demand in the display driver market with customers building high-volume SoCs for smart device displays, and Kilopass XPM delivers compelling value and performance," said Suk Lee, TSMC Senior Director, Design Infrastructure Marketing Division. "By passing TSMC 9000, Kilopass assures its customers that the IP going into these designs meets the highest standards for quality and time-to-market reliability."
Availability
Kilopass' XPM eNVM IP is available for immediate shipment in the TSMC 55nm HV process as well as most other TSMC processes from 0.18-micron to 28nm. Please email [email protected] for more information.
Source: http://www.kilopass.com