Cabot
Microelectronics Corporation, the world’s leading
supplier of chemical mechanical planarization (CMP) polishing slurries
to the semiconductor industry, announces a major breakthrough in its
CMP technology with improvements to its B6600 platform of barrier CMP
slurries for advanced technology nodes.
Cabot Microelectronics is the leading supplier of copper
polishing slurry solutions for the semiconductor industry. The B6600
barrier slurry platform builds on Cabot Microelectronics’
industry-leading CMP slurry technology and is the result of extensive
research and development by Cabot Microelectronics intended to deliver
an integrated, best-in-class solution for copper barrier CMP at
advanced technology nodes.
Cabot Microelectronics’ B6600 barrier slurry
platform is tunable, enabling the products to be easily customized to
deliver excellent planarity and defect performance across a wide range
of integration schemes. Recent technology advancements made by Cabot
Microelectronics’ scientists provide excellent low-K
dielectric and copper removal rate control, resulting in superior
electrical performance. The B6600 barrier slurry products are being
produced and used worldwide for technology nodes from 90 nm through 45
nm.
Thomas Kelly, Cabot Microelectronics’ Global
Business Director for Copper and Barrier products, stated,
“Our new line of advanced barrier slurry products is designed
to provide customers with greatly enhanced flexibility to customize and
fit their specific processes. Further, the B6600 platform of products
offers customers electrical performance that is unmatched in the market
with an attractive cost of ownership.”